High frequency module
First Claim
1. A high frequency module for mounting on a motherboard, comprising:
- a substrate;
a semiconductor chip fixed on the substrate;
a heat sink having a projecting portion in contact with the semiconductor chip; and
a means, provided to cover the heat sink, for conducting heat transferred to the heat sink to the substrate;
wherein the heat conducting means is a cap having a flat portion covering the heat sink and extended portions led out from opposite edges of the flat portion; and
wherein the extended portions of the cap are connected to electrodes formed on the motherboard.
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Accused Products
Abstract
An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present invention employs a substrate 11, a semiconductor chip 13 fixed on the substrate 11, a roof plate 15 being contact with an upper surface 13a of the semiconductor chip 13, and a cap, which is contact with an upper surface of the roof plate, having a flat portion 16a and extended portions 16b leaded out below from opposite ends of the flat portion 16a. The extended portions 16b of the cap 16 are contact with side surfaces of the substrate 11. Thus, a wide area contact between the extended portions 16b of the cap 16 and the side surfaces of the substrate 11 can be ensured even if the height of the semiconductor chip 13 fluctuates or the shape of the cap 16 fluctuates. This results that heat generated from the semiconductor chip 13 is efficiently radiated to the substrate 11.
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Citations
13 Claims
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1. A high frequency module for mounting on a motherboard, comprising:
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a substrate;
a semiconductor chip fixed on the substrate;
a heat sink having a projecting portion in contact with the semiconductor chip; and
a means, provided to cover the heat sink, for conducting heat transferred to the heat sink to the substrate;
wherein the heat conducting means is a cap having a flat portion covering the heat sink and extended portions led out from opposite edges of the flat portion; and
wherein the extended portions of the cap are connected to electrodes formed on the motherboard. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A high frequency module for mounting on a motherboard, comprising:
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a substrate;
a semiconductor chip fixed on the substrate;
a heat sink having a projecting portion in contact with the semiconductor chip;
a means, provided to cover the heat sink, for conducting heat transferred to the heat sink to the substrate; and
an electronic component provided in a space formed between the heat sink and the substrate. - View Dependent Claims (13)
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Specification