Sealed electronic device packages with transparent coverings
First Claim
1. An electronic device package comprising:
- a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
a layer of nonconductive material in contact with and encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad; and
a transparent lid covering a surface of said electronic device, said transparent lid having edges in adhesive contact with said layer of nonconductive material; and
a layer of material adhered to said carrier substrate that contacts and encapsulates said layer of nonconductive material and said edges of said transparent lid.
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Accused Products
Abstract
The invention provides improved packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. Methods of assembly are also provided. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
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Citations
8 Claims
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1. An electronic device package comprising:
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a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of said carrier substrate;
at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
a layer of nonconductive material in contact with and encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad; and
a transparent lid covering a surface of said electronic device, said transparent lid having edges in adhesive contact with said layer of nonconductive material; and
a layer of material adhered to said carrier substrate that contacts and encapsulates said layer of nonconductive material and said edges of said transparent lid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification