×

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

  • US 6,906,416 B2
  • Filed: 10/08/2003
  • Issued: 06/14/2005
  • Est. Priority Date: 10/08/2002
  • Status: Expired due to Term
First Claim
Patent Images

1. A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the second package is inverted and wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-down configuration.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×