Methods and devices for charge management for three-dimensional sensing

• US 6,906,793 B2
• Filed: 06/17/2003
• Issued: 06/14/2005
• Est. Priority Date: 12/11/2000
• Status: Expired due to Term

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Canesta Incorporated (Microsoft Corporation)
• Inventors: Bamji, Cyrus, Liu, Xinqiao
• Primary Examiner(s): Gregory, Bernarr E.
• Assistant Examiner(s): ALSOMIRI, ISAM A
• Application Number:
  US10/464,299
• Publication Number:
  US 20030223053A1
• Time in Patent Office: 728 Days
• Field of Search: 348/302, 348/313, 356 401- 515, 356/141.1
• US Class Current: 356/141.1
• CPC Class Codes: G01C 3/00 Measuring distances in line of sight; Optical rangefinders tapes, chains or wheels for measuring length G01B3/00; active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves, G01S17/48
• CPC Class Codes: G01J 3/50 using electric radiation detectors
• CPC Class Codes: G01S 17/36 with phase comparison between the received signal and the contemporaneously transmitted signal
• CPC Class Codes: G01S 17/894 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
• CPC Class Codes: G01S 7/4914 of detector arrays, e.g. charge-transfer gates
• CPC Class Codes: G01S 7/493 Extracting wanted echo signals
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 31/02024 Position sensitive and lateral effect photodetectors; Quadrant photodiodes
• CPC Class Codes: H01L 31/1133 the device being a conductor-insulator-semiconductor diode or a CCD device

Abstract

Structures and methods for three-dimensional image sensing using high frequency modulation includes CMOS-implementable sensor structures using differential charge transfer, including such sensors enabling rapid horizontal and slower vertical dimension local charge collection. Wavelength response of such sensors can be altered dynamically by varying gate potentials. Methods for producing such sensor structures on conventional CMOS fabrication facilities include use of “rich” instructions to command the fabrication process to optimize image sensor rather than digital or analog ICs. One detector structure has closely spaced-apart, elongated finger-like structures that rapidly collect charge in the spaced-apart direction and then move collected charge less rapidly in the elongated direction. Detector response is substantially independent of the collection rate in the elongated direction.

Claims

1. For use in a system that illuminates a target with optical energy having a modulated periodic waveform that includes a high frequency component and that detects with at least one photodetector a fraction of said optical energy reflected by said target, a method of improving detection comprising the following steps:

providing each said photodetector with means for steering charge generated within said photodetector by said fraction of optical energy to a collection node in said photodetector; and

collecting at least some of said charge from said collection node.

2. The method of claim 1, wherein said means for steering charge includes:

providing a semiconductor photodetector with first and second sources formed in a substrate, and forming on a surface of said substrate first and second charge transfer gates, and a depletion gate disposed between said first and second charge transfer gates;

and coupling voltage signals to said first and second charge transfer gates to steer said charge generated by said photodetector to at least one of said first and second sources.

3. The method of claim 1, further including modulating quantum efficiency of said photodetector.

4. The method of claim 2, wherein in a plan view, said depletion gate is disposed between said first and second charge transfer gates, which first and second charge transfer gates are disposed intermediate said first and second sources.

5. The method of claim 2, further including:

providing means for protecting charge collected by said first and second sources from as least one periodic signal present at at least one of said depletion gate and said first and second charge transfer gates.

6. The method of claim 2, wherein:

said photodetector is a semiconductor photodetector provided with first and second sources formed a substrate, and has formed on a surface of said substrate a depletion gate disposed between first and second bias gates, and has formed first and second charge transfer gates disposed between said first and second bias gates;

said first and second bias gates being biased at a potential to protect charge collected by said first and second sources from at least one periodic signal present at at least one of said depletion gate and said first and second charge transfer gates.

7. The method of claim 1, further including electrically varying sensitivity response of said photodetector to a wavelength of said optical energy.

8. The method of claim 1, wherein:

said system measures distance between said system and said target using time-of-flight information obtained from said photodetector.

9. A CMOS-implementable semiconductor photodetector useable in a system that illuminates a target with optical energy having a modulated periodic waveform that includes a high frequency component, and detects a fraction of said optical energy reflected by said target with at least one said semiconductor photodetector, said semiconductor photodetector including:

a substrate;

first and second sources formed in said substrate;

first and second charge transfer gates formed on a surface of said substrate;

a depletion gate disposed between said first and second charge transfer gates;

wherein charge generated within said substrate by optical energy is steered to at least one of said first and second sources responsive to voltage signals coupleable to said first and second charge transfer gates.

10. The semiconductor photodetector of claim 9, further including means for protecting charge collected by said first and second sources from at least one periodic signal present at at least one of said depletion gate and said first and second charge transfer gates.

11. The semiconductor photodetector of claim 9, further including at least first and second bias gates disposed on said surface of said substrate between, in a plan view, said first and second charge transfer gates and said first and second sources;

wherein said first and second bias gates are coupleable to a source of bias potential selected to protect charge collected by first and second sources from at least one periodic signal present at at least one of said depletion gate and said first and second charge transfer gates.

12. The semiconductor photodetector of claim 9, further including means for modulating quantum efficiency of said semiconductor photodetector.

13. The semiconductor photodetector of claim 9, further including means for electrically varying sensitivity response of said semiconductor photodetector to wavelength of said optical energy.

14. The semiconductor photodetector of claim 9, wherein said system measures distance between said system and said target using time-of-flight information obtained from said semiconductor photodetector.

15. For use in a system that illuminates a target with optical energy having a modified periodic waveform that includes a high frequency component and that detects with at least one semiconductor photodetector a fraction of said optical energy reflected by said target, a method of improving detection performance comprising the following steps:

providing each said semiconductor photodetector with a first group and a second group of spaced-apart elongated structures formed on a substrate, wherein a distance in an x-direction separating adjacent said structures is substantially less than a length in a y-direction of said structures;

dynamically biasing said semiconductor photodetector such that detection-generated charge within said substrate is moved at a first rate in said x-direction for local collection by at least at a first region of said elongated structures, and at least some of said detection-generated charge at said first region is moved at a second rate in said y-direction for collection at a second region of said elongated structures;

wherein performance of said semiconductor photodetector is substantially dependent on said first rate and is substantially independent of said second rate.

16. The method of claim 15, wherein said first rate is substantially more rapid than said second rate.

17. The method of claim 15, wherein said elongated structures are gate structures;

are further including maintaining a potential differential between said first region and said second region of said gate structures.

18. The method of claim 16, further including coupling a clock signal to said first region of said gate structures and coupling a capacitor to said second region of said gate structures.

19. The method of claim 16, further including dynamically altering depletion depth associated with said first group of gate structures, with said second group of gate structures.

20. The method of claim 16, further including electrically varying sensitivity response of said semiconductor photodetector to wavelength of said optical energy.

21. The method of claim 15, further including modulating quantum efficiency of said semiconductor photodetector.

22. The method of claim 15, wherein said system measures distance between said system and said target using time-of-flight information obtained from said semiconductor photodetector.

23. For use in a system that illuminates a target with optical energy having a modulated periodic waveform that includes a high frequency component and that detects a fraction of said optical energy reflected by said target, at least one CMOS-implementable semiconductor photodetector used with said system to detect said fraction, said semiconductor photodetector including:

a first group and a second group of spaced-apart elongated structures formed on a substrate, wherein distance in an x-direction separating adjacent said structures is substantially less than a length in a y-direction of said structures;

said semiconductor photodetector being biasable such that detection-generated charge within said substrate is moved at a first rate in said for local collection by at least at a first region of said elongated structures, and at least some of said detection-generated charge at said first region is moved at second rate in said y-direction for collection at a second region of said elongated structures;

wherein performance of said semiconductor photodetector is substantially dependent on said first rate and is substantially independent of said second rate.

24. The semiconductor photodetector of claim 23, wherein said first rate is substantially more rapid than said second rate.

25. The semiconductor photodetector of claim 23, wherein said elongated structure are gate structures;

and

said first and second regions of said gate structures are biasable to maintain a potential differential therebetween.

26. The semiconductor photodetector of claim 23, wherein said elongated structures are gate structures, and further including a capacitor coupled to said second portion of said gate structures.

27. The semiconductor photodetector of claim 23, wherein said elongated structures are gate structures, and further including means for dynamically altering depletion depth associated with said at least one of said first group of gate structures, and with said second group of gate structures.

28. The semiconductor photodetector of claim 23, further including means for electrically varying sensitivity response of said semiconductor photodetector to wavelength of said optical energy.

29. The semiconductor photodetector of claim 23, further including means for modulating quantum efficiency of said semiconductor photodetector.

30. The semiconductor photodetector of claim 23, wherein said system measures distance between said system and said target using time-of-flight information obtained from said semiconductor photodetector.