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Micromechanical inertial sensor

  • US 6,907,782 B2
  • Filed: 11/30/2001
  • Issued: 06/21/2005
  • Est. Priority Date: 12/02/2000
  • Status: Expired due to Fees
First Claim
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1. A micromechanical inertial sensor comprising:

  • a gimbal structure formed from a single wafer having a wafer plane, the gimbal structure including a first oscillating element having a first axis of oscillation coupled to a second oscillating element having a second axis of oscillation aligned substantially perpendicular to the first axis of oscillation, an exciter unit configured to oscillate the first oscillating element;

    a first sensing device configured to sense a deflection of the second oscillating element;

    a first plate formed from the single wafer, the first plate being pivotable about a first axis of rotation and deflectable by an acceleration acting perpendicular to the first axis of rotation;

    a second sensing device configured to sense a deflection of the first plate;

    a first mass element attached to the first plate, wherein a common center of gravity of the first plate and the first mass element is offset from the first axis of rotation in a direction of the wafer plane; and

    a second plate formed in the single wafer and a third sensing device, the second plate being pivotable about a second axis of rotation and deflectable by an acceleration acting perpendicular to the second axis of rotation, the third sensing device configured to sense a deflection of the second plate.

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