MEMS device wafer-level package
First Claim
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1. A method of manufacturing a semiconductor device comprising:
- a) providing a semiconductor wafer;
b) forming a plurality of dies on the semiconductor wafer;
c) placing a bead of adhesive about the perimeter of the at least one die; and
d) attaching a window above at least one individual die of the plurality of dies while the at least one die is still part of the semiconductor wafer.
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Abstract
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
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Citations
30 Claims
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1. A method of manufacturing a semiconductor device comprising:
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a) providing a semiconductor wafer;
b) forming a plurality of dies on the semiconductor wafer;
c) placing a bead of adhesive about the perimeter of the at least one die; and
d) attaching a window above at least one individual die of the plurality of dies while the at least one die is still part of the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a semiconductor device comprising:
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a) providing a semiconductor wafer;
b) forming a plurality of devices on the semiconductor wafer; and
c) soldering a window above at least one individual device of the plurality of devices while the at least one device is still part of the semiconductor wafer, said window operable to cover said at least one individual device while not covering any of said plurality of devices adjacent to said at least one individual device. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method of manufacturing a semiconductor device comprising:
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a) providing a semiconductor wafer;
b) forming a plurality of dies on the semiconductor wafer;
c) placing a bead of adhesive about the perimeter of the at least one die; and
d) attaching a window above at least one individual die of the plurality of dies, the bead of adhesive being operable to adhere the window to the at least one die while the at least one die is still a part of the semiconductor wafer, said window operable to cover said at least one individual die while not covering any of said plurality of dies adjacent to said at least one individual die. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification