Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric

• US 6,909,051 B2
• Filed: 03/27/2002
• Issued: 06/21/2005
• Est. Priority Date: 04/26/1999
• Status: Expired due to Fees

• Current Assignee: Microsoft Corporation
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Noble, Robert Henry
• Primary Examiner(s): Gibson, Randy W.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US10/107,972
• Publication Number:
  US 20020134583A1
• Time in Patent Office: 1,182 Days
• Field of Search: 174/251, 174/260, 174/261, 174/84.C, 174262-266, 298/43, 298/60, 298/61, 439/83
• US Class Current: 174/251
• CPC Class Codes: H01R 12/515 Terminal blocks providing connections to wires or cables
• CPC Class Codes: H01R 12/53 connecting to cables except for flat or ribbon cables
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 4/183 for cylindrical elongated bodies, e.g. cables having circular cross-section H01R4/01 takes precedence
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H01R 43/048 Crimping apparatus or processes H01R43/042 takes precedence
• CPC Class Codes: H05K 13/0465 by soldering H05K13/0469 takes precedence
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49151 by deforming or shaping
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/53213 Assembled to wire-type conductor
• CPC Class Codes: Y10T 29/53217 Means to simultaneously assemble multiple, independent conductors to terminal
• CPC Class Codes: Y10T 29/53252 Means to simultaneously fasten three or more parts
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the first side of the circuit board; providing a first coupler having a conductive lead portion and a ductile conductive tube portion extending from the conductive lead portion; engaging the conductive lead portion with the solder dispensed upon the first side of the circuit board; heating the circuit board, the solder and the conductive lead portion so that the solder reflows, thereby securing the first coupler to the first side of the circuit board; inserting an extremity of the first conductor into the ductile conductive tube portion; and crimping the ductile conductive tube portion so as to provide crimped retention of the first conductor therein. Circuit boards, devices and systems also are provided.

Claims

1. A circuit board comprising:

a substrate having a first side, an opposing second side and a first aperture formed through the substrate and extending from the first side to the second side;

first solder applied to the first side of the substrate adjacent to the first aperture;

a first coupler engaging the first side of the circuit board and being secured thereto by the first solder, the first coupler having a first conductive lead portion and a first ductile conductive tube portion extending from the first conductive lead portion, at least a portion of the first coupler overlying the first aperture; and

a first transmission line having a first conductor and heat sensitive dielectric engaged about at least a portion thereof, an extremity of the first conductor being engaged in crimped retention within the first ductile conductive tube portion such that the heat sensitive dielectric is not engaged in crimped retention by the first coupler.

2. The circuit board of claim 1, wherein the portion of the first coupler overlying the first aperture is at least a portion of the first ductile conductive tube portion.

3. The circuit board of claim 1, further comprising:

a second aperture formed through the substrate and extending from the first side to the second side;

a second coupler having a second conductive lead portion and a second ductile conductive tube portion extending from the second conductive lead portion, at least a portion of the second coupler overlying the second aperture;

second solder applied to the second side of the substrate, the second coupler engaging the second side of the circuit board and being secured thereto by the second solder; and

a second transmission line having a second conductor and heat sensitive dielectric engaged about at least a portion thereof, an extremity of the second conductor being engaged in crimped retention within the second ductile conductive tube portion.

4. The circuit board of claim 3, wherein the portion of the second coupler overlying the second aperture is at least a portion of the second ductile conductive tube portion.

5. The circuit board of claim 1, further comprising a conductive collar having an interior and an exterior, the interior receiving the first conductor, the exterior being received within the first ductile conductive tube portion.

6. The circuit board of claim 5, wherein the interior of the conductive collar is sized and shaped to prevent insertion of the heat sensitive dielectric therein.

7. The circuit board of claim 1, wherein the first coupler is oriented substantially parallel to the first side of the substrate.

8. The circuit board of claim 7, wherein the first coupler spans across the first aperture.

12. The circuit board of claim 7, wherein the first transmission line includes a heat sensitive dielectric engaged about at least a portion of the first conductor.

9. A circuit board comprising:

a substrate having a first side, an opposing second side and a first aperture formed through the substrate and extending from the first side to the second side;

a first coupler engaging the first side of the circuit board at a location adjacent the first aperture, the first coupler having a first conductive lead portion and a first ductile conductive tube portion extending from the first conductive lead portion, at least a portion of the first coupler overlying the first aperture;

a first transmission line having a first conductor, the first conductor being engaged in crimped retention within the first ductile conductive tube portion; and

a conductive collar having an interior and an exterior, the interior receiving the first conductor, the exterior being received within the first ductile conductive tube portion.

10. The circuit board of claim 9, wherein:

the first transmission line includes a heat sensitive dielectric engaged about at least a portion of the first conductor; and

the interior of the conductive collar is sized and shaped to prevent insertion of the heat sensitive dielectric therein.

11. A circuit board comprising:

a substrate having a first side, an opposing second side and a first aperture formed through the substrate and extending from the first side to the second side;

a first coupler engaging the first side of the circuit board at a location adjacent the first aperture, the first counter having a first conductive lead portion and a first ductile conductive tube portion extending from the first conductive lead portion, at least a portion of the first coupler overlying the first aperture; and

a first transmission line having a first conductor, the first conductor being engaged in crimped retention within the first ductile conductive tube portion,

wherein the first coupler is oriented substantially parallel to the first side of the substrate.

13. The circuit board of claim 11, further comprising:

solder engaging the first side of the substrate and securing the first coupler to the first side of the substrate.

14. The circuit board of claim 11, wherein the portion of the first coupler overlying the first aperture is at least a portion of the first ductile conductive tube portion.

15. The circuit board of claim 11, wherein an extremity of the first conductor is inserted into the first ductile conductive tube portion and crimped therein for providing crimped retention of the first conductor.

16. The circuit board of claim 11, wherein the first ductile conductive tube portion exhibits a continuous exterior periphery.

17. The circuit board of claim 11, wherein the first coupler spans across the first aperture.

18. A circuit board of comprising:

a substrate having a first side, an opposing second side and a first aperture formed through the substrate and extending from the first side to the second side;

a first coupler engaging the first side of the circuit board at a location adjacent the first aperture, the first coupler having a first conductive lead portion and a first ductile conductive tube portion extending from the first conductive lead portion, at least a portion of the first coupler overlying the first aperture; and

a first transmission line having a first conductor, the first conductor being engaged in crimped retention within the first ductile conductive tube portion,

wherein the first transmission line includes a heat sensitive dielectric engaged about at least a portion of the first conductor, and

wherein the heat sensitive dielectric is not engaged in crimped retention by the first coupler.