Package structure of a composite LED

• US 6,909,234 B2
• Filed: 12/09/2002
• Issued: 06/21/2005
• Est. Priority Date: 06/27/2002
• Status: Expired due to Fees

• Current Assignee: Solidlite Corp.
• Original Assignee: Solidlite Corp.
• Inventors: Chen, Hsing
• Primary Examiner(s): Williams, Joseph
• Assistant Examiner(s): COLON, GERMAN
• Application Number:
  US10/315,649
• Publication Number:
  US 20040000867A1
• Time in Patent Office: 925 Days
• Field of Search: 257/88, 257 98-100, 257/678, 257/684, 257/687, 313/512, 313498-511, 438106-108, 438/118, 438/127
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

A package structure of a composite LED is to package an LED chip into a SMD LED package subbody component. Then, a single SMD LED package subbody component or multiple SMD LED package subbody components may be packaged into a large sized recessed package mother body, thereby forming the package structure of a composite LED. Thus, the quality is better, and the color shift is less, thereby enhancing the quality of production, and thereby decreasing the cost of production. In addition, the SMD LED may be previously classified according to the features, and may then be packaged into the mother body, thereby obtaining better features, such as Vf, color, brightness or the like.

Claims

1. A package structure of a composite LED, comprising:

an LED chip;

a substrate upon which to fix the LED chip, the substrate having positive and negative electrodes;

a package colloid containing a phosphor, such that the phosphor is excited by light emitted from the LED chip;

a plurality of SMD LED package subbody components included in the LED chip, the substrate and the package colloid containing a phosphor, all being formed into an integral body;

a large sized package mother body having inner electrodes connected to outer electrodes of the SMD LED package subbody components; and

a transparent package colloid in the large sized package mother body, for covering the SMD LED package subbody components.

2. The package of a composite LED in accordance with claim 1, wherein the LED chip is packaged into the SMD LED package subbody component in a diode bonding and wire bonding manner or in a Filp Chip manner.

3. The package of a composite LED in accordance with claim 1, wherein the large sized package mother body is made of a metal, a PCB, a semiconductor or plastic material.

4. The package of a composite LED in accordance with claim 1, wherein the large sized package mother body has a top light type, a side light type, a lamp type and a SMD type.

5. The package of a composite LED in accordance with claim 4, wherein the large sized package mother body has a top light type, a side light type, a lamp type and a SMD type.

6. The package method of a composite LED, comprising the steps of:

providing a plurality of small sized SMD LED package subbody components each containing a phosphor;

providing a large sized package mother body;

packaging the small sized SMD LED package subbody components into the large sized package mother body, so that outer electrodes of the SMD LED package subbody components are connected to inner electrodes of the large sized package mother body; and

adding a package colloid into the large sized package mother body, thereby forming a composite LED.

7. The package method of a composite LED in accordance with claim 6, wherein the SMD LED package subbody components included a red SMD LED, a green SMD LED and a blue SMD LED which are packaged into the large sized package mother body simultaneously, thereby forming a single triple-wavelength white LED.

8. The package method of a composite LED in accordance with claim 6, wherein the SMD LED package subbody components includes a white SMD LED or a mixed color SMD LED excited by other phosphor.