Matrix driven electrophoretic display with multilayer back plane

• US 6,909,532 B2
• Filed: 04/23/2003
• Issued: 06/21/2005
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: E Ink California, LLC (E Ink Corporation)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Liang, Rong-Chang, Chaug, Yi-Shung, Hou, Jack, Chung, Jerry, Haubrich, Jeanne E.
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): HASAN, MOHAMMED A
• Application Number:
  US10/422,413
• Publication Number:
  US 20030206331A1
• Time in Patent Office: 790 Days
• Field of Search: 359/296, 359/254, 345/107, 349/42, 349/43, 349/158, 349/73, 349/74, 252/72, 252/59
• US Class Current: 359/296
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: G02F 1/13629 Multilayer wirings
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 2201/42 Arrangements for providing conduction through an insulating substrate

Abstract

A matrix driven electrophoretic display with a multi-layer back plane is disclosed. The display comprises a top electrode layer, a display cell layer, and a multi-layer back plane. In one embodiment, the multi-layer back plane comprises an electrode formed on the top surface of the top substrate of the multi-layer back plane, a conductive via structure through the substrate, and a conductive trace connected electrically to the via structure at the bottom surface of the first substrate, whereby an electrical connection may be made from the electrode to a structure or component not located immediately beneath the electrode in the multi-layer back plane. In other embodiments, the multi-layer back plane may comprise additional layers and via holes, as needed to connect the electrode with the appropriate switching elements and/or driver elements, as applicable. Such switching and driver elements, integrated with multi-layer back plane.

Claims

1. A matrix driven electrophoretic display comprising:

a top electrode layer;

a multi-layer back plane; and

an electrophoretic cell layer positioned between the top electrode layer and the multi-layer back plane;

wherein the multi-layer back plane comprises;

a first conductive layer formed on a first substrate having a top surface and a bottom surface, the first conductive layer comprising an electrode formed on the top surface of the first substrate, the electrode comprising a metal thin film structure having a thickness of no greater than 5 microns;

a second conductive layer comprising a circuit routing trace associated with the electrode;

a third conductive layer comprising a circuit element associated with the electrode; and

a first via structure communicating from the first conductive layer to the second conductive layer through the first substrate; and

wherein the first via structure forms at least part of a conductive path by which said electrode formed on the top surface of the first substrate is connected electrically to said circuit routine trace associated with the electrode.

2. A matrix driven electrophoretic display as recited in claim 1, wherein the top electrode layer comprises a common electrode.

3. A matrix driven electrophoretic display as recited in claim 1, wherein the top electrode layer comprises a plurality of electrodes, each electrode overlying a plurality of electrophoretic cells.

4. A matrix driven electrophoretic display as recited in claim 3, wherein the plurality of electrodes comprises a plurality of column electrodes.

5. A matrix driven electrophoretic display as recited in claim 3, wherein the plurality of electrodes comprises a plurality of row electrodes.

6. A matrix driven electrophoretic display as recited in claim 1, further comprising a second via structure communicating from the second conductive layer to the third conductive layer.

7. A matrix driven electrophoretic display as recited in claim 1, wherein the electrophoretic cell layer comprises a plurality of electrophoretic cells.

8. A matrix driven electrophoretic display as recited in claim 7, wherein the plurality of electrophoretic cells comprises a plurality of microcup type electrophoretic cells.

9. A matrix driven electrophoretic display as recited in claim 1, wherein the electrophoretic cell layer comprises a plurality of electrophoretic cells and the electrode is associated with at least one of said electrophoretic cells.

10. A matrix driven electrophoretic display as recited in claim 1, wherein the first substrate comprises a flexible polymer substrate.

11. A matrix driven electrophoretic display as recited in claim 1, wherein the electrode is formed by a process comprising:

printing with strippable material a pattern on the top surface of the first substrate, the pattern defining an area where the electrode is to be formed;

depositing a metal thin film on the patterned top surface of the first substrate; and

stripping the strippable material from the top surface of the first substrate.

12. A matrix driven electrophoretic display as recited in claim 11, wherein the strippable material comprises a polymer, oligomer, or wax strippable by an organic solvent or solvent mixture.

13. A matrix driven electrophoretic display as recited in claim 11, wherein the strippable material comprises a polymer, oligomer, or wax strippable by an aqueous solution.

14. A matrix driven electrophoretic display as recited in claim 1, wherein the circuit element comprises a switching component associated with the electrode.

15. A matrix driven electrophoretic display as recited in claim 14, wherein the switching component comprises at least one diode.

16. A matrix driven electrophoretic display as recited in claim 14, wherein the switching component comprises at least one transistor.

17. A matrix driven electrophoretic display as recited in claim 14, wherein the switching component comprises at least one MIM (metal-insulator-metal) device.

18. A matrix driven electrophoretic display as recited in claim 14, wherein the switching component comprises at least one varistor.

19. A matrix driven electrophoretic display as recited in claim 14, wherein the multi-layer back plane further comprises a second substrate having a top surface and a bottom surface and the switching component is formed on the bottom surface of the second substrate.

20. A matrix driven electrophoretic display as recited in claim 19, wherein the multi-layer back plane further comprises a second via structure communicating from the top surface of the second substrate to the bottom surface of the second substrate.

21. A matrix driven electrophoretic display as recited in claim 20, wherein the switching component is connected electrically to the electrode via a path comprising the second via structure, the circuit routing trace, and the first via structure.

22. A matrix driven electrophoretic display as recited in claim 1, wherein the first via structure is formed by a process comprising:

forming through the first substrate a via hole associated with the electrode and the circuit routing trace, the via hole communicating from the top surface of the first substrate to the bottom surface of the first substrate.

23. A matrix driven electrophoretic display as recited in claim 22, wherein the process by which the first via structure is formed further comprises filling the via hole at least partially with conductive material to form a conductive path between the electrode and the circuit routing trace.

24. A matrix driven electrophoretic display as recited in claim 23, wherein the conductive material comprises conductive ink.

25. A matrix driven electrophoretic display as recited in claim 24, wherein the conductive ink comprises silver paste.

26. A matrix driven electrophoretic display as recited in claim 24, wherein the conductive ink comprises carbon black or graphite paste.

27. A matrix driven electrophoretic display as recited in claim 24, wherein the conductive ink comprises conducting polymer.

28. A matrix driven electrophoretic display as recited in claim 22, wherein the process by which the first via structure is formed further comprises coating the sides of the via hole at least partially with conductive material to form a conductive path between the electrode and the circuit routing trace.

29. A matrix driven electrophoretic display as recited in claim 28, wherein the conductive material comprises metal plating.

30. A matrix driven electrophoretic display as recited in claim 29, wherein the metal plating comprises copper plating.

31. A matrix driven electrophoretic display as recited in claim 28, wherein the step of coating the via hole at least partially with conductive material comprises:

laminating the top surface of the first substrate with a dry photoresist film;

patterning the dry photoresist film by exposing selected portions to ultraviolet light, the pattern being such that the via hole and at least part of the electrode will be uncovered after removal of uncured portions of the photoresist;

removing uncured portions of the dry photoresist film;

depositing a layer of colloidal graphite on the top surface of the first substrate and the side walls of the via hole; and

using electro-plating to deposit a layer of metal on the surfaces covered by the colloidal graphite.

32. A matrix driven electrophoretic display as recited in claim 31, wherein the step of coating the via hole at least partially with conductive material further comprises stripping the cured portion of the dry photoresist film from the top surface of the first substrate.

33. A matrix driven electrophoretic display as recited in claim 32, wherein the step of stripping is performed after both the colloidal graphite layer and the metal layer have been deposited.

34. A matrix driven electrophoretic display as recited in claim 32, wherein the step of stripping is performed after the colloidal graphite layer has been deposited but before the metal layer is deposited.

35. A matrix driven electrophoretic display as recited in claim 31, wherein the layer of metal comprises a layer of copper.

36. A matrix driven electrophoretic display as recited in claim 31, wherein the step of coating the via hole at least partially with conductive material further comprises laminating the bottom surface of the first substrate with a tenting film.

37. A matrix driven electrophoretic display as recited in claim 36, wherein the tenting film comprises a dry photoresist film.

38. A matrix driven electrophoretic display as recited in claim 36, wherein the tenting film comprises masking tape.

39. A matrix driven electrophoretic display as recited in claim 22, wherein the via hole is formed using a laser.

40. A matrix driven electrophoretic display as recited in claim 22, wherein the via hole is formed by mechanical perforation.

41. A matrix driven electrophoretic display as recited in claim 22, wherein the via hole is formed by computer numerical controlled (CNC) drilling.

42. A matrix driven electrophoretic display as recited in claim 14, wherein the multi-layer back plane comprises a plurality of substrates and the switching component is formed on one of the substrates.

43. A matrix driven electrophoretic display as recited in claim 42, wherein the substrates are laminated together.

44. A matrix driven electrophoretic display as recited in claim 42, wherein the third conductive layer comprises a driving circuit and component layer.

45. A matrix driven electrophoretic display as recited in claim 44, wherein the driving circuit and component layer comprises a component attached to the bottom surface of the bottom-most substrate of the multi-layer back plane.

46. A matrix driven electrophoretic display as recited in claim 45, wherein the component comprises the circuit element.

47. A matrix driven electrophoretic display as recited in claim 45, wherein the component comprises a capacitor associated with the electrode.

48. A matrix driven electrophoretic display as recited in claim 45, wherein the component comprises a driving circuit associated with the electrode.

49. A matrix driven electrophoretic display as recited in claim 45, wherein the component comprises an integrated circuit.

50. A matrix driven electrophoretic display as recited in claim 49, wherein the integrated circuit comprises a switching component associated with the electrode.

51. A matrix driven electrophoretic display as recited in claim 49, wherein the integrated circuit comprises a driving circuit associated with the electrode.

52. A matrix driven electrophoretic display as recited in claim 49, wherein the integrated circuit comprises a microprocessor, or microcontroller, or application specific integrated circuit (ASIC).