Thermally matched fluid cooled power converter

• US 6,909,607 B2
• Filed: 12/18/2002
• Issued: 06/21/2005
• Est. Priority Date: 01/16/2002
• Status: Active Grant

• Current Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Kannenberg, Daniel G., Kaishian, Steven C., Radosevich, Lawrence D., Beihoff, Bruce C.
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US10/252,319
• Publication Number:
  US 20030133268A1
• Time in Patent Office: 916 Days
• Field of Search: 165/80.2, 165/80.4, 318/722, 361688-689, 361698-699, 361702-703, 363/141, 363/144, 363/147
• US Class Current: 361/699
• CPC Class Codes: H02M 1/44 Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Claims

1. A modular power converter comprising:

a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;

an interface plate secured to the thermal support and contacting the coolant stream during operation;

at least one power electronic device subassembly disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device, the interface plate and the electronics device subassembly being at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the interface plate and the thermal support.

2. The modular power converter of claim 1, wherein the interface plate and the thermal support are made of different materials.

3. The modular power converter of claim 1, wherein the power electronics device is formed of a plurality overposed layers including a solid state switch, interfaces between the layers being thermally matched to limit the differential expansion during operation of the solid state switch.

4. The modular power converter of claim 3, wherein the overposed layers include a substrate on which the solid state switch is disposed.

5. The modular power converter of claim 1, wherein the interface plate consists essentially of AlSiC.

6. The modular power converter of claim 3, wherein the layers include a substrate layer bonded to the interface plate, the solid state switch being disposed on the substrate layer.

7. The modular power converter of claim 6, wherein the substrate layer comprises ceramic layer direct bonded to an aluminum layer.

8. The modular power converter of claim 6, wherein the substrate layer comprises a ceramic layer direct bonded to a copper layer.

9. The modular power converter of claim 1, wherein the power electronics device is part of a subassembly joined to the support and interfacing directly with the internal fluid conduit.

10. The modular power converter of claim 9, wherein the subassembly is joined to the support by welding.

11. The modular power converter of claim 9, wherein the subassembly is removably joined to the support by mechanical fastening means and is sealed to the support.

12. The modular power converter of claim 1, wherein the power electronics device includes a plurality of bonding layers thermally matched to adjacent device layers to reduce differential thermal expansion during operation.

13. A modular power converter comprising:

a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;

an interface plate secured to the thermal support and contacting the coolant stream during operation;

at least one power electronic device subassembly disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device, the interface plate and the electronics device subassembly being at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the interface plate and the thermal support;

wherein the interface plate and the thermal support are made of different materials.

14. The modular power converter of claim 13, wherein the thermal support is a single-piece support.

15. The modular power converter of claim 13, wherein the thermal support is a multi-piece support.

16. The modular power converter of claim 13, wherein the thermal support includes at least one extension for supporting and cooling additional circuitry.

17. The modular power converter of claim 13, wherein the power electronics circuits form a uni-directional power converter.

18. The modular power converter of claim 13, wherein the power electronics circuits form a bi-directional power converter.

19. A modular power converter comprising:

a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power; and

a fluid cooled support on which the power electronics circuit is directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit for removal of heat therefrom, the support further including an interface plate on which the power electronics circuit is secured and which contacts the cooling fluid during operation, interfaces between the power electronics circuit and and the interface plate being thermally matched to limit differential thermal expansion during operation of the solid state switches.

20. The modular power converter of claim 19, wherein the power electronics circuit is formed of a plurality overposed layers, interfaces between the layers being thermally matched so limit the differential expansion during operation of the solid state switches.

21. The modular power converter of claim 19, wherein the overposed layers include a substrate on which the solid state switches are disposed.

22. The modular power converter of claim 19, wherein the interface plate consists essentially of AlSiC.

23. The modular power converter of claim 21, wherein the layers include a substrate layer bonded to the interface plate, the solid state switches being disposed on the substrate layer.

24. The modular power converter of claim 23, wherein the substrate layer comprises ceramic layer direct bonded to an aluminum layer.

25. The modular power converter of claim 23, wherein the substrate layer comprises a ceramic layer direct bonded to a copper layer.

26. The modular power converter of claim 19, wherein the power electronics circuit is part of a subassembly joined to the support and interfacing directly with the internal fluid conduit.

27. The modular power converter of claim 26, wherein the subassembly is joined to the support by welding.

28. The modular power converter of claim 26, wherein the subassembly is removably joined to the support by mechanical fastening means and is sealed to the support.

29. The modular power converter of claim 19, wherein the power electronics circuit includes a plurality of bonding layers thermally matched to adjacent device layers to reduce differential thermal expansion during operation.

30. A modular power converter comprising:

a plurality of controlled power electronics circuits including solid state switches configured to convert incoming power to controlled outgoing power; and

a fluid cooled support on which the power electronics circuits are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuits for removal of heat therefrom, the support further including an interface plate on which the power electronics circuits are secured and which contacts the cooling fluid during operation, interfaces between the power electronics circuits and the interface plate being thermally matched to limit differential thermal expansion during operation of the solid state switches.

31. The modular power converter of claim 30, wherein the power electronics circuits are secured to a single side of the support.

32. The modular power converter of claim 30, wherein the power electronics circuits are secured to multiple sides of the support.

33. A modular power converter comprising:

a plurality of controlled power electronics circuits including solid state switches configured to convert incoming power to controlled outgoing power, each circuit including a first bonding layer thermally matched to an underlying interface plate, a substrate disposed on the first bonding layer and thermally matched to the first bonding layer, a second bonding layer disposed on the substrate and thermally matched to the substrate, and a device layer disposed on the second bonding layer and thermally matched to the second bonding layer; and

a fluid cooled support on which the power electronics circuits are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling toward the interface plate for removal of heat therefrom during operation of the solid state switches.

34. The modular power converter of claim 33, wherein the interface plate consists essentially of AlSiC.

35. The modular power converter of claim 33, wherein the substrate comprises ceramic layer direct bonded to an aluminum layer.

36. The modular power converter of claim 33, wherein the substrate comprises a ceramic layer direct bonded to a copper layer.

37. The modular power converter of claim 33, wherein the power electronics circuits comprise at least one subassembly joined to the support and interfacing directly with the internal fluid conduit.

38. The modular power converter of claim 37, wherein the subassembly is joined to the support by welding.

39. The modular power converter of claim 37, wherein the subassembly is removably joined to the support by mechanical fastening means and is sealed to the support.

40. The modular power converter of claim 37, wherein the power electronics circuits comprise a plurality of subassemblies.

41. The modular power converter of claim 40, wherein the subassemblies are secured to at least two different sides of the support.