Die down multi-media card and method of making same
First Claim
1. A circuit module comprising:
- a leadframe having;
at least one die pad;
a plurality of contacts; and
a plurality of conductive traces extending from respective ones of the contacts toward the die pad;
the traces being bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
a semiconductor die attached to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes, the semiconductor die being electrically connected to at least one of the traces; and
a body at least partially encapsulating the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.
4 Assignments
0 Petitions
Accused Products
Abstract
A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.
-
Citations
26 Claims
-
1. A circuit module comprising:
-
a leadframe having;
at least one die pad;
a plurality of contacts; and
a plurality of conductive traces extending from respective ones of the contacts toward the die pad;
the traces being bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
a semiconductor die attached to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes, the semiconductor die being electrically connected to at least one of the traces; and
a body at least partially encapsulating the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A memory card comprising:
-
a leadframe having;
at least one die pad;
a plurality of contacts; and
a plurality of conductive traces extending from respective ones of the contacts toward the die pad;
the traces being bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
a semiconductor die attached to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes, the semiconductor die being electrically connected to at least one of the traces; and
a body at least partially encapsulating the leadframe and the semiconductor die such that the contacts are exposed within a bottom surface defined by the body. - View Dependent Claims (7, 8, 9)
-
-
10. A method of fabricating a circuit module, comprising the steps of:
-
a) providing a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad;
b) bending the traces in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
c) attaching a semiconductor die to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes;
d) electrically connecting the semiconductor die to at least one of the traces; and
e) partially encapsulating the leadframe and the semiconductor die with a body such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
-
-
18. A method of fabricating a memory card, comprising the steps of:
-
a) providing a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad;
b) bending the traces in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
c) attaching a semiconductor die to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes;
d) electrically connecting the semiconductor die to at least one of the traces; and
e) partially encapsulating the leadframe and the semiconductor die with a body such that the contacts are exposed within a bottom surface defined by the body. - View Dependent Claims (19, 20, 21, 22, 23, 24)
-
-
25. A method of fabricating a memory card, comprising the steps of:
-
a) providing a circuit module which comprises a substrate having a plurality of contacts, and a semiconductor die which is attached to the substrate and electrically connected to the contacts;
b) placing the circuit module into a mold cavity having a prescribed form factor; and
c) injecting a polymeric material into the mold cavity and around the circuit module in a manner wherein at least a portion of each of the contacts is not covered by the polymeric material. - View Dependent Claims (26)
-
Specification