Methods and systems for forming slots in a substrate

• US 6,911,155 B2
• Filed: 01/31/2002
• Issued: 06/28/2005
• Est. Priority Date: 01/31/2002
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Hager, Michael, Miller, Michael D., Kumpf, Susanne L., Khavari, Mehrgan, Buswell, Shen, Enck, Ronald L., Pugliese, Roberto A. Jr., Kawamura, Naoto A.
• Primary Examiner(s): Ahmed, Shamim
• Application Number:
  US10/061,836
• Publication Number:
  US 20030141279A1
• Time in Patent Office: 1,244 Days
• Field of Search: 216/17, 216/27, 216/58, 216/65, 216/67, 219/121.69, 347/65, 347/54, 438/21
• US Class Current: 216/17
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1632 machining

Abstract

The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.

Claims

1. A method of fabricating a slot in a print head substrate, comprising:

dry etching through a first surface of the substrate having a thickness between the first and a second opposing surfaces, wherein said dry etching removes about 50 percent of the thickness of the substrate; and

,

sand drilling through the second surface of the substrate effective to form, in combination with said etching, a slot at least a portion of which passes entirely through the thickness of the substrate, wherein the slot has a maximum slot width measured parallel to the first surface that is less than one half of the thickness.

2. A method of forming fluid handling slots in a semiconductor substrate having a thickness between opposing first and second surfaces comprising:

dry etching into the substrate from the first surface to form a first trench having a trench length and a trench width; and

,

removing substrate material through the second surface to form a second trench, wherein at least a portion of the first and second trenches intersect to form a slot through the substrate, and wherein the slot has a maximum slot width measured parallel to the first surface that is less than one half of the thickness.

3. The method of claim 2, wherein said removing comprises one or more of:

sand drilling, laser machining, dry etching, wet etching, and mechanical drilling.

4. The method of claim 2, wherein said act of dry etching is performed before said act of removing.

5. The method of claim 2, wherein said dry etching comprises multiple acts of dry etching, wherein subsequent individual acts of dry etching remove shorter lengths of substrate than previous individual acts of dry etching.

6. The method of claim 2, wherein the second trench formed by said removing has a maximum second trench width of less than or equal to about 240 microns.

7. The method of claim 2, wherein the second trench formed by said removing has a maximum second trench width of about 50 percent or less the thickness of the substrate.

8. The method of claim 2, wherein the second trench formed by said removing has a length at a region where breakthrough occurs that is approximately equal to the maximum length of the first trench.

9. The method of claim 2, wherein the second trench formed by said removing has a length at a region where breakthrough occurs that is about 25 percent to about 75 percent the length of the first trench where the trenches intersect to form the slot.

10. The method of claim 2, wherein the first trench formed by said dry etching has a depth of about 25 percent to about 75 percent of the thickness of the substrate.

11. The method of claim 2, wherein the second trench formed by said removing has a maximum width of less than or equal to about 300 percent the maximum width of the first trench formed by said dry etching.

12. A method of forming slots in a semiconductor substrate having first and second opposing surfaces comprising:

dry etching a first trench through the first surface of the substrate; and

,

creating a second trench through the second surface of the substrate effective to form, in combination with the first trench, a slot at least a portion of which passes entirely through the substrate, wherein the maximum width of the slot is less than or equal to about 50 percent of the thickness of the substrate.

13. The method of claim 12, wherein said creating a second trench comprises sand drilling.

14. The method of claim 12, wherein said creating a second trench comprises wet etching, dry etching, mechanical drilling, or laser machining.

15. The method of claim 12, wherein said dry etching comprises dry etching into a thin film side.

16. The method of claim 12, wherein said dry etching and said creating form a slot having a configuration that reduces bubble accumulation.

17. The method of claim 12, wherein said act of dry etching is performed prior to said act of creating.