Encapsulation for organic electronic devices
First Claim
1. A method of encapsulating an organic electronic device, comprising:
- fabricating said organic electronic device on a substrate, said organic electronic device having an active area;
selectively depositing a catalyst layer on at least said active area;
exposing said catalyst layer to a monomer to produce a planarization layer where said catalyst layer was selectively deposited; and
selectively depositing a barrier layer on at least said planarization layer.
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Abstract
An embodiment of the present invention pertains to encapsulating an organic electronic device by selectively depositing a catalyst layer and then exposing the catalyst layer to a monomer to produce a planarization layer. The monomer reacts only in the areas where the catalyst layer is present so there is minimal or no contamination of other areas of the organic electronic device. Selectively depositing the catalyst layer allows the resulting planarization layer to be patterned. A barrier layer is selectively deposited on at least the planarization layer.
Another embodiment of the present invention pertains to encapsulating an organic electronic device by depositing a planarization layer on a transfer substrate and then allowing it to stabilize to minimize its reactivity. The planarization layer is transferred from the transfer substrate onto at least an active area of the organic electronic device. A barrier layer is selectively deposited on at least the planarization layer.
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Citations
24 Claims
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1. A method of encapsulating an organic electronic device, comprising:
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fabricating said organic electronic device on a substrate, said organic electronic device having an active area;
selectively depositing a catalyst layer on at least said active area;
exposing said catalyst layer to a monomer to produce a planarization layer where said catalyst layer was selectively deposited; and
selectively depositing a barrier layer on at least said planarization layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An encapsulated electronic device, comprising:
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a substrate;
an organic electronic device on said substrate, said organic electronic device having an active area;
a planarization layer on at least said active area, wherein said planarization layer is formed by selectively depositing a catalyst layer on at least said active area and exposing said catalyst layer to a monomer, wherein said planarization layer resides where said catalyst layer was selectively deposited; and
a barrier layer on at least said planarization layer. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of encapsulating an organic electronic device, comprising:
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fabricating said organic electronic device on a first substrate, said organic electronic device having an active area;
depositing a planarization layer on a second substrate;
stabilizing said planarization layer to minimize its reactivity;
transferring said planarization layer onto at least said active area; and
depositing a barrier layer on at least said planarization layer, wherein stabilizing said planarization layer includes evaporating solvents from said planarization layer, curing said planarization layer, or allowing reactions within said planarization layer to mature to form a more stable and less reactive layer. - View Dependent Claims (17, 18, 19, 20)
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21. An encapsulated electronic device, comprising:
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a substrate;
an organic electronic device on said substrate, said organic electronic device having an active area;
a planarization layer on at least said active area; and
a barrier layer on at least said planarization layer, wherein said planarization layer is first deposited on another substrate and then transferred onto at least said active area, and wherein prior to transferring said planarization layer, said planarization layer is allowed to stabilize to minimize its reactivity, wherein stabilizing said planarization layer includes evaporating solvents from said planarization layer, curing said planarization layer, or allowing reactions within said planarization layer to mature to form a more stable and less reactive layer. - View Dependent Claims (22, 23, 24)
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Specification