Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

• US 6,911,735 B2
• Filed: 03/27/2002
• Issued: 06/28/2005
• Est. Priority Date: 06/08/2000
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Akram, Salman, Ahmad, Syed Sajid
• Primary Examiner(s): Lebentritt, Michael S.
• Assistant Examiner(s): Geyer, Scott B.
• Application Number:
  US10/107,848
• Publication Number:
  US 20020105074A1
• Time in Patent Office: 1,189 Days
• Field of Search: 257/686, 257/688, 257/690, 257/734, 257/737, 257/738, 257/778, 257/779, 257/781
• US Class Current: 257/734
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/44 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10126 Bump collar
• CPC Class Codes: H01L 2224/1148 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/1191 Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y02P 80/30 : Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

Dielectric collars are configured to be positioned laterally around contact pads of a semiconductor device or another substrate. Substrates on which the collars are positioned and that include contact pads that are exposed through the collars are also disclosed, as are methods for fabricating the collars and for positioning the collars on substrates. The collars may be positioned laterally adjacent to the contact pads of a substrate before or after conductive structures are secured to the contact pads. When the conductive structures are electrically connected to contact pads of another semiconductor device component, the collars prevent the material of the conductive structures from contacting regions of the surface of the substrate or other semiconductor device component that surround the contact pads. The collars may be pre-formed structures that are assembled with the substrate, or they may be formed on the substrate. A stereolithographic method of fabricating the collars is disclosed.

Claims

1. A collar positionable around a contact pad of a semiconductor device, the collar including an aperture to which at least a portion of the contact pad is exposed, the collar comprising a plurality of superimposed, contiguous, mutually adhered layers.

2. The collar of claim 1, being configured to prevent material of a conductive structure securable to the contact pad from contacting a region of a surface of the semiconductor device that surrounds the contact pad.

3. The collar of claim 2, including an inner surface defining the aperture and which is configured to be at least partially contacted by at least a portion of the conductive structure within the aperture.

4. The collar of claim 3, wherein the inner surface is configured to define a shape of at least a portion of the conductive structure.

5. The collar of claim 4, wherein the inner surface is configured to define the conductive structure to have a pillar shape.

6. The collar of claim 4, wherein the inner surface is configured to define at least a base portion of the conductive structure and to impart the conductive structure with a mushroom-like shape.

7. The collar of claim 4, wherein the inner surface is configured to define the conductive structure to have a substantially nonball-shaped configuration.

8. The collar of claim 1, wherein at least some of the plurality of layers comprise photopolymer.

9. A support structure for a discrete conductive structure, comprising:

a plurality of at least partially superimposed, mutually adhered, contiguous layers comprising dielectric material; and

a receptacle extending through each of the plurality of at least partially superimposed, mutually adhered, contiguous material layers and configured to receive at least a portion of the discrete conductive structure.

10. The support structure of claim 9, wherein the plurality of at least partially superimposed, mutually adhered, contiguous material layers is configured to prevent material of the discrete conductive structure from extending laterally beyond a periphery of the receptacle.

11. The support structure of claim 9, wherein each of the plurality of at least partially superimposed, mutually adhered, contiguous material layers comprises photopolymer.

12. The support structure of claim 9, wherein the receptacle is configured to contact at least a portion of an external surface of the discrete conductive structure.

13. The support structure of claim 12, wherein the external surface is configured to define a shape of at least a portion of the discrete conductive structure.

14. The support structure of claim 9, wherein the receptacle is configured to receive substantially all of the discrete conductive structure.

15. A form for at least a portion of a discrete conductive structure, comprising:

a body including a plurality of at least partially superimposed, mutually adhered, contiguous dielectric material layers; and

a receptacle laterally confined by the body, the receptacle having a shape into which at least the portion of the discrete conductive structure is to be formed.

16. The form of claim 15, wherein each of the plurality of at least partially superimposed, mutually adhered, contiguous material layers comprises photopolymer.

17. The form of claim 15, wherein the receptacle opens to an end of the body to facilitate communication between the discrete conductive structure and a portion of a contact around which the body is positioned.

18. The form of claim 17, wherein the body prevents material of the portion of the discrete conductive structure from extending laterally beyond an outer periphery of the body.

19. The form of claim 17, wherein the body and the receptacle are configured to facilitate alignment of the discrete conductive structure with the contact.

20. The form of claim 15, wherein the receptacle is configured to form a shape of a substantial length of the discrete conductive structure.