Fan control circuit and package

• US 6,912,134 B2
• Filed: 09/12/2001
• Issued: 06/28/2005
• Est. Priority Date: 09/12/2000
• Status: Expired due to Fees

• Current Assignee: Electronic Motion Systems Holdings Limited
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Grant, William R., Fissore, Sergio
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/949,764
• Publication Number:
  US 20020030977A1
• Time in Patent Office: 1,385 Days
• Field of Search: 361760-761, 361/813, 361785-790, 257/666, 257692-695, 257700-704, 257723-724, 257 98-100, 310/68.R
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 7/20209 Thermal management, e.g. fan control

Abstract

A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon two power switching devices, two intelligent power switches, and a power circuit board on which circuits for controlling the intelligent power switches are disposed. The module includes a power shell that surrounds the dual output power circuit, and a resilient, flexible enclosure which encapsulates the power shell and the circuit components within the power shell.

Claims

1. A power module comprising:

a lead frame, said lead frame including an electrically conductive pad;

a shell;

a plurality of lead terminals extending from within said shell to the exterior of said shell, at least one of said leads serving as a power input lead and electrically connected to said conductive pad, at least another one of said leads serving as a first power output lead and at least a third one of said leads serving as a second power output lead;

a circuit board disposed on a first surface of said electrically conductive pad; and

at least two power switching devices electrically connected to said first surface of said conductive pad;

wherein said power switching devices and said circuit board are disposed side-by-side on said conductive pad, each power switching device is electrically connected to a respective one of said first power output lead and said second power output lead, and said first power output lead is adapted to supply power to a first load, and said second power output lead is adapted to supply power to a second load, said first load and said second load being independently operable devices.

2. A power module according to claim 1, wherein at least one of said power input lead is integral with said conductive pad.

3. A power module according to claim 1, wherein said shell surrounds said conductive pad.

4. The power module of claim 1, wherein said shell and said lead frame are encapsulated by an insulated and flexible enclosure.

5. The power module of claim 1, wherein potting compound is disposed within said shell.

6. The power module of claim 1, further comprising a control circuit for each said power switching device is disposed within said shell.

7. The power module of claim 1, further comprising a status resistor disposed within said shell and electrically connected to a respective power output lead.

8. The power module of claim 4, wherein said enclosure comprises polyamide.

9. The power module of claim 6, wherein each control circuit includes an intelligent power switch and a circuit that controls said intelligent power switch.

10. The power module of claim 9, wherein each said intelligent power switch is disposed on said electrically conductive pad, and said circuit that controls said intelligent power switch is disposed on said circuit board.