Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
First Claim
1. A socket for receiving a first electronic component, said socket comprising:
- a support substrate;
a plurality of elongate, resilient first contact structures extending from a first side of said support substrate and disposed to contact said first electronic component;
a plurality of second contact structures extending from a second side of said support substrate, ones of said first contact structures electrically connected to ones of said second contact structures wherein ones of said second contact structures comprise solder;
a second electronic component, wherein said second contact structures are in electrical communication with said second electronic component, wherein said support substrate comprises electrically conductive through holes electrically connecting said ones of said first contact structures with said ones of said second contact structures.
1 Assignment
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Accused Products
Abstract
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.
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Citations
26 Claims
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1. A socket for receiving a first electronic component, said socket comprising:
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a support substrate;
a plurality of elongate, resilient first contact structures extending from a first side of said support substrate and disposed to contact said first electronic component;
a plurality of second contact structures extending from a second side of said support substrate, ones of said first contact structures electrically connected to ones of said second contact structures wherein ones of said second contact structures comprise solder;
a second electronic component, wherein said second contact structures are in electrical communication with said second electronic component, wherein said support substrate comprises electrically conductive through holes electrically connecting said ones of said first contact structures with said ones of said second contact structures. - View Dependent Claims (2, 3, 4, 5, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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6. The socket of 5, wherein said first contact structures extend a length from said first side of said support substrate, and said frame maintains a minimum distance between said first electronic component and said support substrate, wherein said length is greater than said minimum distance.
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21. A socket for receiving a first electronic component, said socket comprising:
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a support substrate;
first connection means for forming a plurality of readily reversible, pressure-based electrical connections with a first electronic component disposed on a first side of said support substrate;
second connection means for forming a plurality of permanent electrical connections with a second electronic component disposed on a second side of said support substrate wherein said second means comprises solder; and
connecting means for electrically connecting said first connection means with said second connection means wherein said connecting means comprises electrically conductive through holes in said support substrate electrically connecting said first connection means with said second connection means. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification