Light emitting diode

• US 6,914,267 B2
• Filed: 04/06/2004
• Issued: 07/05/2005
• Est. Priority Date: 06/23/1999
• Status: Expired due to Term

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Tsuchiya, Kousuke, Fukasawa, Koichi, Miyashita, Junji
• Primary Examiner(s): Eckert, George
• Assistant Examiner(s): Lee, Eugene
• Application Number:
  US10/817,895
• Publication Number:
  US 20040188700A1
• Time in Patent Office: 455 Days
• Field of Search: 257/95, 257/98, 257/99, 257/100, 257/432
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

A light emitting diode comprising a light emitting diode element 20 mounted on a glass epoxy substrate 12, this light emitting diode element 20 being protected at its surface side by a resin seal member 33, in which: a light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element 20; and a fluorescent material containing layer 21 composed of a fluorescent material containing layer 21 composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element 20, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

Claims

1. A light emitting diode comprising:

A base;

A thin plate-like electrode mounted on the upper surface of the base;

A light emitting diode element fixed to the top surface of the thin plate-like electrode by an adhesive containing fluorescent material;

A resin seal member for sealing the upper surface of the light emitting diode element; and

A recess formed by a portion of the upper surface of the base and by a hole provided in the thin plate-like electrode, said hole having a shape smaller than the shape of the bottom surface of the light emitting diode element;

Wherein the adhesive is filled into the recess and the bottom surface of the light emitting diode element is disposed on the adhesive so that the light emitting diode element is fixed to the thin plate-like electrode.

2. The light emitting diode according to claim 1 wherein a portion in which there is an overlap between the peripheral portion of the hole provided in the thin plate-like electrode and the outer peripheral portion of the bottom surface of the light emitting diode element disposed above the hole forms a reflecting surface of the bottom surface of the light emitting diode element.

3. The light emitting diode according to claim 1 wherein more than two light emitting diode elements are positioned on the base;

At least one of the plurality of light emitting diode elements being a blue light emitting diode element made of gallium nitride semiconductor or a silicon carbide semiconductor;

A recess formed by a portion of the upper surface of the base and by a hole provided in the thin plate-like electrode facing the bottom surface of the blue light emitting diode element, said hole having a shape smaller than the shape of the bottom surface of the blue light emitting diode element;

Wherein the adhesive containing fluorescent material is filled into the recess and the blue light emitting diode element is disposed on the adhesive and fixed.