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Surface acoustic wave device and method of manufacturing the device

  • US 6,914,367 B2
  • Filed: 07/06/2001
  • Issued: 07/05/2005
  • Est. Priority Date: 07/06/2000
  • Status: Expired due to Term
First Claim
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1. A surface acoustic wave device comprising:

  • a surface acoustic wave element with an interdigital transducer formed on a surface of a piezoelectric substrate;

    a base board to which the surface acoustic wave element is flip-chip-connected;

    a base layer applied to a back face of the piezoelectric substrate and hanging from edges of the piezoelectric substrate to the base board to form bridging; and

    a clad layer applied to the base layer, wherein an edge of the base layer is exposed after dicing.

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