Simplified transformer design for a switching power supply

• US 6,914,508 B2
• Filed: 08/15/2002
• Issued: 07/05/2005
• Est. Priority Date: 08/15/2002
• Status: Expired due to Fees

• Current Assignee: Galaxy Power Incorporated
• Original Assignee: Galaxy Power Incorporated
• Inventors: Miller, Gerald, Ng, William, Schroter, Bernhard, Ferencz, Andrew, Zvonar, Gregory A.
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): Poker, Jennifer A.
• Application Number:
  US10/219,114
• Publication Number:
  US 20040032313A1
• Time in Patent Office: 1,055 Days
• Field of Search: 336/200, 336/98, 336/198, 336/223, 336/232, 336/205, 336/192, 361/836, 296/021
• US Class Current: 336/200
• CPC Class Codes: H01F 2027/065 Mounting on printed circuit boards
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A transformer has a primary winding made from a first conducting trace formed on a first multilayer printed circuit board, and a secondary winding made from a second conducting trace formed on a second multilayer printed circuit board. The primary winding is magnetically coupled to the secondary winding. The windings are etched as traces in copper layers of the PC boards as spirals. The spiral of one copper layer is connected to the spiral of a different copper layer by a via, or vias, formed through the insulating layer of the PC board. The vias are drilled, cleaned, and plated with conducting material, for example copper. By using multiple layers, and by connecting spiral windings of each layer to the windings of the next layer by use of vias, any number of turns can be built into a primary winding, or into a secondary winding.

Claims

1. A transformer, comprising:

a first winding made from a first conducting trace formed on a first multilayer printed circuit board;

a second winding made from a second conducting trace formed on a second multilayer printed circuit board, said winding magnetically coupled to said second winding;

a plurality of connection pads on said second multilayer printed circuit board;

a first connection tab connected to a first end of said first winding; and

a second connection tab connected to a second end of said first winding, said first connection tab and said second connection tab arranged for soldering to a corresponding connection pad of said plurality of connection pads on said second multilayer printed circuit board, said soldering attaching said first multilayer printed circuit board to said second multilayer printed circuit board.

2. The apparatus as in claim 1, further comprising:

a ferromagnetic core having “

E”

shape geometry to form a low reluctance magnetic path coupling said primary winding with said secondary winding, a central arm of said “

E”

shaped ferromagnetic core passing through a hole in said first multilayer printed circuit board and said second multilayer printed circuit board to pass through a center of said primary winding and said secondary winding.

3. The apparatus as in claim 1, further comprising:

said first multilayer printed circuit board is attached to said second multilayer printed circuit board.

4. The apparatus as in claim 1, further comprising:

said first multilayer printed circuit board and said second multilayer printed circuit board are packaged together as a single multilayer printed circuit board.

5. The apparatus as in claim 1, further comprising:

said first winding is a primary winding, said first winding is made from a first spiral conducting trace in a first layer of said first multilayer printed circuit board, and a second spiral trace in a second layer of said first multilayer printed circuit board, and an electrically conducting via electrically connecting said first spiral conducting trace to said second spiral conducting trace.

6. The apparatus as in claim 1, further comprising:

said second winding is a secondary winding, said second winding is made from a first spiral conducting trace in a first layer of said second multilayer printed circuit board, and a second spiral conducting trace in a second layer of said second multilayer printed circuit board, and an electrically conducting via electrically connecting said first spiral conducting trace to said second spiral conducting trace.

12. The apparatus as in claim 1, further comprising:

said second multilayer printed circuit board being larger than said first multilayer printed circuit board.

7. A transformer, comprising:

a primary winding made from a plurality of first spiral conducting traces formed in a first multilayer printed circuit board;

a secondary winding made from a plurality of second spiral conducting traces formed in a second multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding, and said second multilayer printed circuit board is a mother board holding a plurality of electronic components, said first and second multilayer printed circuit boards are different sizes;

a plurality of connection pads on said second multilayer printed circuit board;

a first connection tab connected to a first end of said primary winding; and

a second connection tab connected to a second end of said primary winding, said first connection tab and said second connection tab arranged for soldering to a corresponding connection pad of said plurality of connection pads on said second multilayer printed circuit board, said soldering attaching said first multilayer printed circuit board to said second multilayer printed circuit board.

8. The apparatus as in claim 7, further comprising:

said first multilayer printed circuit board and said second multilayer printed circuit board bonded together as a single multilayer printed circuit board.

9. The apparatus as in claim 7, further comprising:

said first multilayer printed circuit board is attached to said second printed circuit board.

10. The apparatus as in claim 7, further comprising:

at least one first electrical conducting via to electrically connect a first spiral conducting trace in a first layer of said first multilayer printed circuit board to a second spiral conducting trace in a second layer of said first multilayer printed circuit board, said first spiral conducting trace and said second spiral conducting trace each selected from said plurality of first spiral conducting traces.

11. The apparatus as in claim 7, further comprising:

at least one first electrical conducting via to electrically connect a first spiral conducting trace in a first layer of said second multilayer printed circuit board to a second spiral conducting trace in a second layer of said second multilayer printed circuit board, said first spiral conducting trace and said second spiral conducting trace each selected from said plurality of second spiral conducting traces.

13. The apparatus as in claim 7, further comprising:

said second multilayer printed circuit board being larger than said first multilayer printed circuit board.

14. A transformer, comprising:

a primary winding made from a first conducting trace formed on a first multilayer printed circuit board, said primary winding is made from a first multiturn spiral conducting trace in a first layer of said first multilayer printed circuit board, and a second spiral trace in a second layer of said first multilayer printed circuit board, and an electrically conducting via electrically connecting said first spiral conducting trace to said second spiral conducting trace;

a secondary winding made from a second multiturn conducting trace formed on a second multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding, said secondary winding made from a first spiral conducting trace in a first layer of said second multilayer printed circuit board, and a second spiral trace in a second layer of said second multilayer printed circuit board, and an electrically conducting via electrically connecting said first spiral conducting trace to said second spiral conducting trace, said first and second multilayer printed circuit boards being different sizes;

a plurality of connection pads on said second multilayer printed circuit board;

a first connection tab connected to a first end of said primary winding; and

a second connection tab connected to a second end of said primary winding, said first connection tab and said second connection tab arranged for soldering to a corresponding connection pad of said plurality of connection pads on said second multilayer printed circuit board, said soldering attaching said first multilayer printed circuit board to said second multilayer printed circuit board.

15. The apparatus as in claim 14, further comprising:

said second multilayer printed circuit board being larger than said first multilayer printed circuit board.

16. A method of making a transformer, comprising:

forming a first winding from a first multiturn conducting trace on a first multilayer printed circuit board;

forming a second winding made from a second multiturn conducting trace on a second multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding;

forming a plurality of connection pads on said second multilayer printed circuit board;

connecting a first connection tab to a first end of said first winding; and

connecting a second connection tab to a second end of said first winding, said first connection tab and said second connection tab arranged for soldering to a corresponding connection pad of said plurality of connection pads on said second multilayer printed circuit board, said soldering attaching said first multilayer printed circuit board to said second multilayer printed circuit board.

17. The method of claim 16, further comprising:

forming a low reluctance magnetic path coupling said primary winding with said secondary winding by a ferromagnetic core having “

E”

shape geometry, a central arm of said “

E”

shaped ferromagnetic core passing through a hole in said first multilayer printed circuit board and said second multilayer printed circuit board to pass through a center of said primary winding and said secondary winding.

18. The method of claim 16, further comprising:

using a mother board holding a plurality of electronic components as said second multilayer printed circuit board.

19. The method of claim 16, further comprising:

packaging said first multilayer printed circuit board and said second multilayer printed circuit board together as a single multilayer printed circuit board.

20. The method of claim 16, further comprising:

making a first spiral conducting trace in a first layer of said first multilayer printed circuit board;

making a second spiral conducting trace in a second layer of said first multilayer printed circuit board; and

electrically connecting by an electrically conducting via said first spiral conducting trace to said second spiral conducting trace, to make said first winding.

21. The method of claim 16, further comprising:

making a first spiral conducting trace in a first layer of said second multilayer printed circuit board;

making a second spiral conducting trace in a second layer of said second multilayer printed circuit board; and

electrically connecting by an electrically conducting via said first spiral conducting trace to said second spiral conducting trace, to make said second winding.

22. The method as in claim 16, further comprising:

fabricating said second multilayer printed circuit board so it is larger than said first multilayer printed circuit board.

23. A transformer, comprising:

a multilayer printed circuit board;

a primary winding made from a first conducting multiturn spiral trace formed on at least one first printed circuit board of said multilayer printed circuit board;

a secondary winding made from at least one second conducting multiturn spiral trace formed on a second printed circuit board of said multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding;

a selected winding of said primary winding and said secondary winding having a first end and a second end;

a first principal connection tab connected to said first end of said selected winding, said first principal connection tab located parallel with a plurality of other connection tabs located in different layers of said multilayer printed circuit board, said first connection tab and said plurality of parallel connection tabs located in different layers of said multilayer printed circuit board having a semicircular shape to form a concave semi-cylindrical shape;

electrically conducting material deposited on said concave semi-cylindrical shape to form an electrical contact to each of said first connection tab and said plurality of connection tabs located in different layers of said multilayer printed circuit board; and

a plurality of additional principal connection tabs connected to selected locations in said selected winding, each connection tab of said plurality of principal connection tabs located parallel to a plurality of other connection tabs, each connection tab with its parallel connection tabs having a semi-cylindrical shape coated with conductive material to form an electrical contact for said selected location of said selected winding.

24. The apparatus as in claim 23, further comprising:

said electrical conducting material is copper electroplated to said semi-cylindrical shape formed by said connection tabs.

25. The apparatus as in claim 23, further comprising:

a printed circuit mother board, said mother board having a plurality of connection pads arranged for one said pad to contact one of said semi-cylindrical shapes formed by connection tabs of said multilayer printed circuit board, said connection pad and said semi-cylindrical shape of connection tabs joined electrically and mechanically by solder.

26. A transformer, comprising:

a multilayer printed circuit board;

a primary winding made from a first conducting multiturn spiral trace formed on at least one first printed circuit board of said multilayer printed circuit board, said primary winding having a first end and a second end;

a secondary winding made from at least one second conducting multiturn spiral trace formed on a second printed circuit board of said multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding;

a first principal connection tab connected to said first end of a selected winding of said primary and said secondary windings, said first principal connection tab located parallel with a plurality of other connection tabs located in different layers of said multilayer printed circuit board, said first connection tab and said plurality of parallel connection tabs located in different layers of said multilayer printed circuit board having a semi-circular shape to form a concave semi-cylindrical shape;

electrically conducting material deposited on said concave semi-cylindrical shape to form an electrical contact to each of said first connection tab and said plurality of connection tabs located in different layers of said multilayer printed circuit board; and

a plurality of additional principal connection tabs connected to selected locations in said selected winding, each connection tab of said plurality of principal connection tabs located parallel to a plurality of other connection tabs, each connection tab with its parallel connection tabs having a semi-cylindrical shape coated with conductive material to form an electrical contact for said selected location of said selected winding.

27. The apparatus as in claim 26, further comprising:

a printed circuit mother board, said mother board having a plurality of connection pads arranged for one said pad to contact one of said semi-cylindrical shapes formed by connection tabs of said multilayer printed circuit board, said connection pad and said semi-cylindrical shape of connection tabs joined electrically and mechanically by solder.

28. A transformer, comprising:

a primary winding made from a first conducting trace formed on a first multilayer printed circuit board;

a secondary winding made from a second conducting trace formed on a second multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding, and said second multilayer printed circuit board is a mother board holding a plurality of electronic components and second multilayer printed circuit board contains at least one slot adapted to receive a portion of a ferromagnetic core used to form a low reluctance magnetic path coupling said primary and secondary windings;

a plurality of connection pads on said second multilayer printed circuit board;

a first connection tab connected to a first end of said primary winding; and

a second connection tab connected to a second end of said primary winding, said first connection tab and said second connection tab arranged for soldering to a corresponding connection pad of said plurality of connection pads on said second multilayer printed circuit board, said soldering attaching said first multilayer printed circuit board to said second multilayer printed circuit board.

29. A transformer, comprising:

a multilayer printed circuit board;

a primary winding made from a first conducting multiturn spiral trace formed on at least one first printed circuit board of said multilayer printed circuit board;

a secondary winding made from at least one second conducting multiturn spiral trace formed on a second printed circuit board of said multilayer printed circuit board, said primary winding magnetically coupled to said secondary winding;

a selected winding of said primary winding and said secondary winding having a first end and a second end; and

a first principal connection tab connected to said first end of said selected winding, said first principal connection tab located parallel with a plurality of other connection tabs located in different layers of said multilayer printed circuit board, said first connection tab and said plurality of parallel connection tabs located in different layers of said multilayer printed circuit board having a semicircular shape to form a concave semi-cylindrical shape.

30. The apparatus as in claim 29, further comprising:

electrically conducting material deposited on said concave semi-cylindrical shape to form an electrical contact to each of said first connection tab and said plurality of connection tabs located in different layers of said multilayer primed circuit board.