Ball grid array antenna

• US 6,914,566 B2
• Filed: 05/17/2002
• Issued: 07/05/2005
• Est. Priority Date: 05/17/2001
• Status: Active Grant

• Current Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Beard, Paul
• Primary Examiner(s): Le, Hoanganh
• Application Number:
  US10/147,827
• Publication Number:
  US 20020171591A1
• Time in Patent Office: 1,145 Days
• Field of Search: H01/Q00.1/24, 343/700.MS, 343/866, 343/895, 343/795, 343/793, 343/741, 343/702, 343/873
• US Class Current: 343/702
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/242 specially adapted for hand-held use
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0442 with particular tuning means
• CPC Class Codes: H01Q 9/065 Microstrip dipole antennas patch antenna H01Q9/0407
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/26 with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

An antenna for a wireless communications device may be configured in a variety of shapes. The antenna is not limited to a two dimensional space, but may incorporate conductive antenna elements from an integrated circuit package, a circuit board to which the integrated circuit package mounts, and signal conducting connecting means between the integrated circuit package and the circuit board.

Claims

1. An antenna for a wireless communications device, comprising:

a first length formed from at least two interconnection elements between an integrated circuit package and a circuit board to which the integrated circuit package is mounted.

2. The antenna of claim 1, the at least two interconnection elements comprising at least two solder balls.

3. The antenna of claim 2, wherein the interconnection elements are electrically connected by being melted.

4. The antenna of claim 2, wherein the interconnection elements are electrically connected by an application of molten solder.

5. The antenna of claim 4, wherein the solder is lead free.

6. The antenna of claim 4, wherein the solder contains two or more of the group consisting of lead, bismuth, tin, antimony, copper, silver, zinc, and indium.

7. The antenna of claim 1, the at least two interconnection elements comprising at least two input/output pins.

8. The antenna of claim 1, further comprising a second length and a third length which connect to the first length to form the antenna.

9. The antenna of claim 8, wherein at least one of the second and third lengths is formed from a conductive trace within the integrated circuit package.

10. The antenna of claim 8, wherein at least one of the second and third lengths is formed from a conductive trace within the circuit board.

11. The antenna of claim 8, wherein at least one of the second and third lengths is formed on or in a structure which attaches to the integrated circuit package.

12. The antenna of claim 11, wherein the structure is flexible.

13. The antenna of claim 11, wherein the structure is bendable.

14. The antenna of claim 11, wherein the structure is rigid.

15. The antenna of claim 11, wherein the structure is attached by a solder connection.

16. The antenna of claim 11, wherein the structure is adhesively attached.

17. The antenna of claim 11, wherein the structure is mechanically attached.

18. The antenna of claim 8, wherein at least one of the second and third lengths is formed on or in a structure which attaches to the circuit board.

19. The antenna of claim 18, wherein the structure is flexible.

20. The antenna of claim 18, wherein the structure is bendable.

21. The antenna of claim 18, wherein the structure is rigid.

22. The antenna of claim 18, wherein the structure is attached by a solder connection.

23. The antenna of claim 18, wherein the structure is adhesively attached.

24. The antenna of claim 18, wherein the structure is mechanically attached.

25. The antenna of claim 1, wherein the integrated circuit package is a ball grid array.

26. The antenna of claim 8, wherein each of the first, second, and third lengths includes one or more solder balls.

27. The antenna of claim 8, wherein dielectric material is disposed around at least one of the first, second, and third lengths.

28. The antenna of claim 8, wherein the first, second, and third lengths are disposed at different heights with respect to the circuit board.

29. The antenna of claim 1, a first one and a second one of the at least two interconnection elements independently configured to attach the integrated circuit package to the circuit board.

30. The antenna of claim 1, the first length arranged substantially parallel to the integrated circuit package and time circuit board.

31. The antenna of claim 1, a first one of the at least two interconnection elements substantially the same as a second one of the at least two interconnection elements.

32. A method of manufacturing a radio chip package, comprising:

mounting a radio upon a chip of a ball grid array package;

forming a series of solder balls from said ball grid array package suitable for creating an antenna; and

connecting said radio to said series,

wherein said radio is capable of improved transmission and reception via said series.

33. A method of manufacturing an antenna, comprising:

processing a mounting surface to make it receptive to an electrically conductive material;

applying the electrically conductive material to the mounting surface in a liquefied form; and

hardening the electrically conductive material applied to the mounting surface to form an antenna.

34. The method of manufacturing of claim 33, wherein the antenna forms a pattern.

35. The method of manufacturing of claim 34, wherein the electrically conductive material consists of solder in its entirety.

36. The method of manufacturing of claim 35, wherein the antenna pattern is connected to a radio.

37. The method of manufacturing of claim 33, wherein the electrically conductive material includes interconnection elements from an integrated circuit package.

38. The method of manufacturing of claim 37, wherein the interconnection elements are solder balls.

39. An antenna for a wireless communications device, comprising:

a first length having an end which conductively attaches to radio frequency processing circuitry;

a second length having an end which conductively attaches to the other end of the first length; and

a third length having an end which conductively attaches to the other end of the second length,

wherein the first, second, and third lengths are formed in parallel planes which are at different heights with respect to the major planar extension of an integrated circuit package and a circuit board to which the integrated circuit package is mounted.

40. The antenna of claim 39, wherein the antenna is a helical antenna.

41. The antenna of claim 40, wherein the antenna is entirely formed within the integrated circuit package.

42. The antenna of claim 40, wherein the antenna is entirely formed within the circuit board.

43. The antenna of claim 39, wherein the antenna is a patch antenna.

44. The antenna of claim 39, wherein the antenna is a microstrip antenna.

45. The antenna of claim 39, wherein one of the first, second, and third lengths is formed from two or more interconnection elements between an integrated circuit package and a circuit board to which the integrated circuit package is mounted.

46. The antenna of claim 39, wherein the antenna includes solder balls.