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MEMS device and method of forming MEMS device

  • US 6,914,709 B2
  • Filed: 10/02/2003
  • Issued: 07/05/2005
  • Est. Priority Date: 10/02/2003
  • Status: Expired due to Fees
First Claim
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1. A method of forming a micro-mirror device, the method comprising:

  • providing a substructure including a base material and at least one conductive layer formed on a side of the base material;

    forming a layer of dielectric material over the at least one conductive layer of the substructure;

    depositing a conductive material on the layer of dielectric material, including communicating the conductive material with the at least one conductive layer of the substructure through the layer of dielectric material;

    forming a sacrificial layer of silicon over the conductive material and the layer of dielectric material;

    forming a reflective element over the sacrificial layer of silicon; and

    substantially removing the sacrificial layer of silicon between the reflective element and the layer of dielectric material.

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