Piezoelectric/electrostrictive device and method of manufacturing same
First Claim
1. A method for producing a piezoelectric/electrostrictive device comprising:
- a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and
one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;
preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;
securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive;
securing said plurality of thin plates to said support substrate by the aid of a second adhesive to manufacture a master device block including said plurality of thin plates disposed opposingly; and
dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections.
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Abstract
A piezoelectric/electrostrictive (P/E) device includes at least one actuator section secured to thin plate sections with an adhesive. The actuator section includes a multilayered member including at least three actuator films, each of which include a P/E layer and electrode films. One or more holes or recesses are formed in portions of the thin plate sections on which the P/E elements are formed. The electrode films contact upper and lower surfaces of respective P/E layers and alternately extend to opposite surfaces thereof. End surface electrodes electrically connect an electrode film that contacts one of the P/E layers and an electrode film that contacts another one of the P/E layers. The end surface electrodes are electrically connected to terminals which are provided on a surface of an outermost layer of the P/E layers, and which are separated from one another by a predetermined distance.
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Citations
38 Claims
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1. A method for producing a piezoelectric/electrostrictive device comprising:
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a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and
one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;
preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;
securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive;
securing said plurality of thin plates to said support substrate by the aid of a second adhesive to manufacture a master device block including said plurality of thin plates disposed opposingly; and
dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for producing a piezoelectric/electrostrictive device comprising:
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a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and
one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;
preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;
securing said plurality of thin plates to said support substrate by the aid of a second adhesive;
securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive to manufacture a master device block including said plurality of thin plates disposed opposingly; and
dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for producing a piezoelectric/electrostrictive device comprising:
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a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and
one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;
preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;
securing said plurality of thin plates to said support substrate by diffusion joining or welding, said thin plates being disposed opposingly;
securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive to manufacture a master device block; and
dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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Specification