Piezoelectric/electrostrictive device and method of manufacturing same

• US 6,915,547 B2
• Filed: 08/01/2002
• Issued: 07/12/2005
• Est. Priority Date: 10/01/1999
• Status: Expired due to Fees

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Takeuchi, Yukihisa, Namerikawa, Masahiko, Shibata, Kazuyoshi
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/210,309
• Publication Number:
  US 20020194717A1
• Time in Patent Office: 1,076 Days
• Field of Search: 29/253.5, 294/12, 294/17, 295/94, 298/30, 298/31, 310/321, 310/324, 310/328, 310/330, 310/331, 310/367, 310/368, 156/250, 156/267, 156/268, 156/269, 156/275.7, 156/300, 735/041.3
• US Class Current: 29/25.35
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/097 by sintering
• CPC Class Codes: H10N 30/2042 Cantilevers, i.e. having one fixed end
• CPC Class Codes: H10N 30/2043 connected at their free ends, e.g. parallelogram type
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49794 Dividing on common outline
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 Punching, piercing or reaming part by surface of second part

Abstract

A piezoelectric/electrostrictive (P/E) device includes at least one actuator section secured to thin plate sections with an adhesive. The actuator section includes a multilayered member including at least three actuator films, each of which include a P/E layer and electrode films. One or more holes or recesses are formed in portions of the thin plate sections on which the P/E elements are formed. The electrode films contact upper and lower surfaces of respective P/E layers and alternately extend to opposite surfaces thereof. End surface electrodes electrically connect an electrode film that contacts one of the P/E layers and an electrode film that contacts another one of the P/E layers. The end surface electrodes are electrically connected to terminals which are provided on a surface of an outermost layer of the P/E layers, and which are separated from one another by a predetermined distance.

Claims

1. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;

preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;

securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive;

securing said plurality of thin plates to said support substrate by the aid of a second adhesive to manufacture a master device block including said plurality of thin plates disposed opposingly; and

dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections.

2. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends for holding an object member; and

said support substrate is a rectangular annular structure having a portion defining said object member, and a portion defining said fixation section.

3. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends; and

said support substrate is a rectangular annular structure having a portion for supporting said open ends, and a portion defining said fixation section.

4. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein at least one of said first adhesive and said second adhesive comprises organic resin.

5. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein at least one of said first adhesive and said second adhesive comprises one of glass, brazing material, and solder.

6. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein at least one of said thin plates and said support substrate comprises metal.

7. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein:

said step of dividing said master device block further comprises a treatment for cutting said master device block along predetermined cutting lines; and

said cutting is performed in substantially the same direction as a displacement direction of said pair of thin plate sections.

8. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of forming an underlying layer on a surface of said piezoelectric/electrostrictive element opposed to said thin plate before securing said piezoelectric/electrostrictive element to said thin plate by the aid of said first adhesive.

9. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of forming one or more holes or recesses at least at a portion of said thin plate to which said piezoelectric/electrostrictive element is secured.

10. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of roughening at least a portion of a surface of said thin plate to which said piezoelectric/electrostrictive element is secured.

11. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of forming a curvature for a stick-out shape of said second adhesive protruding from an opposing portion between said thin plate and said support substrate.

12. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of chamfering mutually opposing angular portions of said support substrate of said master device block.

13. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising the step of:

manufacturing said thin plate by stamping a metal plate, wherein;

when said master device block is produced by combining said thin plate with said support substrate, a burr, which is brought about on said thin plate due to said stamping, is directed outwardly to produce said master device block.

14. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;

preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;

securing said plurality of thin plates to said support substrate by the aid of a second adhesive;

securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive to manufacture a master device block including said plurality of thin plates disposed opposingly; and

dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections.

15. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends for holding an object member;

said support substrate is a rectangular annular structure having a portion defining said object member, and a portion defining said fixation section.

16. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends; and

said support substrate is a rectangular annular structure having a portion for supporting said open ends, and a portion defining said fixation section.

17. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein at least one of said first adhesive and said second adhesive comprises organic resin.

18. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein at least one of said first adhesive and said second adhesive comprises one of glass, brazing material, and solder.

19. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein at least one of said thin plates and said support substrate comprises metal.

20. The method for producing said piezoelectric/electrostrictive device according to claim 14, wherein:

said step of dividing said master device block further comprises a treatment for cutting said master device block along predetermined cutting lines; and

said cutting is performed in substantially the same direction as a displacement direction of said pair of thin plate sections.

21. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of forming an underlying layer on a surface of said piezoelectric/electrostrictive element opposed to said thin plate before securing said piezoelectric/electrostrictive element to said thin plate by the aid of said first adhesive.

22. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of forming one or more holes or recesses at least at a portion of said thin plate to which said piezoelectric/electrostrictive element is secured.

23. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of roughening at least a portion of a surface of said thin plate to which said piezoelectric/electrostrictive element is secured.

24. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of forming a curvature for a stick-out shape of said second adhesive protruding from an opposing portion between said thin plate and said support substrate.

25. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of chamfering mutually opposing angular portions of said support substrate of said master device block.

26. The method for producing said piezoelectric/electrostrictive device according to claim 14, further comprising the step of:

manufacturing said thin plate by stamping a metal plate, wherein;

when said master device block is produced by combining said thin plate with said support substrate, a burr, which is brought about on said thin plate due to said stamping, is directed outwardly to produce said master device block.

27. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, and a fixation section for supporting said thin plate sections; and

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, said method comprising the steps of;

preparing a plurality of thin plates, said piezoelectric/electrostrictive element, and a support substrate;

securing said plurality of thin plates to said support substrate by diffusion joining or welding, said thin plates being disposed opposingly;

securing said piezoelectric/electrostrictive element to at least one of said thin plates by the aid of a first adhesive to manufacture a master device block; and

dividing said master device block into a plurality of chips to manufacture each said piezoelectric/electrostrictive device, wherein at least portions of said plurality of thin plates define said thin plate sections.

28. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends for holding an object member; and

said support substrate is a rectangular annular structure having a portion defining said object member, and a portion defining said fixation section.

29. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein:

said pair of thin plate sections of said piezoelectric/electrostrictive device include open ends; and

said support substrate is a rectangular annular structure having a portion for supporting said open ends, and a portion defining said fixation section.

30. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein said first adhesive comprises organic resin.

31. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein said first adhesive comprises glass, brazing material, and solder.

32. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein at least one of said thin plates and said support substrate comprises metal.

33. The method for producing said piezoelectric/electrostrictive device according to claim 27, wherein:

said step of dividing said master device block further comprises a treatment for cutting said master device block along predetermined cutting lines; and

said cutting is performed in substantially the same direction as a displacement direction of said pair of thin plate sections.

34. The method for producing said piezoelectric/electrostrictive device according to claim 27, further comprising the step of forming an underlying layer on a surface of said piezoelectric/electrostrictive element opposed to said thin plate before securing said piezoelectric/electrostrictive element to said thin plate by the aid of said first adhesive.

35. The method for producing said piezoelectric/electrostrictive device according to claim 27, further comprising the step of forming one or more holes or recesses at least at a portion of said thin plate to which said piezoelectric/electrostrictive element is secured.

36. The method for producing said piezoelectric/electrostrictive device according to claim 27, further comprising the step of roughening at least a portion of a surface of said thin plate to which said piezoelectric/electrostrictive element is secured.

37. The method for producing said piezoelectric/electrostrictive device according to claim 27, further comprising the step of chamfering mutually opposing angular portions of said support substrate of said master device block.

38. The method for producing said piezoelectric/electrostrictive device according to claim 27, further comprising the step of:

manufacturing said thin plate by stamping a metal plate, wherein;

when said master device block is produced by combining said thin plate with said support substrate, a burr, which is brought about on said thin plate due to said stamping, is directed outwardly to produce said master device block.