Multi-barrel die transfer apparatus and method for transferring dies therewith

• US 6,915,551 B2
• Filed: 12/19/2002
• Issued: 07/12/2005
• Est. Priority Date: 08/02/2002
• Status: Active Grant

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Primary Examiner(s): Hong, John C.
• Application Number:
  US10/322,718
• Publication Number:
  US 20040020039A1
• Time in Patent Office: 936 Days
• Field of Search: 294/58, 294/28, 296/00, 297/29, 297/40, 297/59, 297/43, 297/00, 156/60, 414/627, 414/754, 414/772, 414/773
• US Class Current: 29/458
• CPC Class Codes: B29C 33/06 using radiation , e.g. electro-magnetic waves, induction heating
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49885 : with coating before or during assembling
• CPC Class Codes: Y10T 29/53039 : with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53191 : Means to apply vacuum directly to position or hold work part
• CPC Class Codes: Y10T 29/53261 : Means to align and advance work part

Abstract

A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

Claims

1. A method for transferring a plurality of dies from a first surface to a second surface, comprising:

(a) applying in parallel each hollow barrel of a plurality of hollow barrels to a respective die residing on the first surface;

(b) causing the respective die to move into each hollow barrel in parallel;

(c) repeating steps (a) and (b) until each hollow barrel contains a stack of dies of a predetermined number; and

(d) depositing in parallel a die from each hollow barrel onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

2. The method of claim 1, wherein step (b) comprises:

applying a vacuum force to a first end of each hollow barrel to cause the respective die to move into a second end of each hollow barrel.

3. The method of claim 2, wherein step (d) comprises:

modifying the vacuum force.

4. The method of claim 2, wherein step (a) comprises:

applying the first end of each hollow barrel of the plurality of hollow barrels to the second surface in parallel to deposit the respective die from each hollow barrel to the second surface.

5. The method of claim 2, wherein step (a) comprises:

applying the second end of each hollow barrel of the plurality of hollow barrels to the second surface in parallel to deposit the respective die from each hollow barrel to the second surface.

6. The method of claim 1, wherein step (b) comprises:

using a gas pressure to cause the respective die to move into each hollow barrel.

7. The method of claim 6, wherein step (d) comprises:

modifying the gas pressure.

8. The method of claim 1, wherein step (b) comprises:

using a mechanical force to cause the respective die to move into each hollow barrel.

9. The method of claim 1, wherein step (b) comprises:

using a chemical force to cause the respective die to move into each hollow barrel.

10. The method of claim 1, wherein step (b) comprises:

using an electrostatic force to cause the respective die to move into each hollow barrel.

11. The method of claim 1, wherein step (b) comprises:

using an adhesive material to cause the respective die to move into each hollow barrel.

12. The method of claim 1, wherein step (d) comprises:

allowing the die deposited from each hollow barrel to stick to the second surface.

13. A system for transferring a plurality of dies from a first surface to a second surface, comprising:

a plurality of hollow barrels aligned to be substantially parallel, each hollow barrel of said plurality of hollow barrels being configured to contain a plurality of dies in a stack

a vacuum device coupled to a first end of said each hollow barrel; and

wherein a second end of said each hollow barrel is applied in parallel to a respective die residing on the first surface;

wherein said vacuum device applies a vacuum force to said first end of said each hollow barrel to cause said respective die to move into said second end of said each hollow barrel in parallel; and

wherein said vacuum force is modified and said each hollow barrel is applied to the second surface to deposit said respective die from said each hollow barrel onto the second surface in parallel.

14. The system of claim 13, wherein the first end of said each hollow barrel is applied to the second surface to deposit said respective die from said each hollow barrel to the second surface in parallel.

15. The system of claim 13, wherein the second end of said each hollow barrel is applied to the second surface to deposit said respective die from said each hollow barrel to the second surface in parallel.

16. The system of claim 13, wherein said respective die is one of a plurality of dies residing on the first surface that corresponds to said each hollow barrel;

wherein said second end of said each hollow barrel is applied in parallel sequentially to each die of said corresponding plurality of dies while said vacuum force is applied to move said each die of said corresponding plurality of dies into the second end of said each hollow barrel to form a stack of dies in said each hollow barrel.

17. The system of claim 16, wherein said each hollow barrel is applied to a plurality of target areas on the second surface in parallel to sequentially deposit each die of said corresponding plurality of dies on the second surface.

18. The system of claim 13, wherein the first surface is a scribed wafer.

19. The system of claim 13, wherein the first surface is a support surface.

20. The system of claim 13, wherein the second surface is an intermediate surface.

21. The system of claim 13, wherein the second surface is a substrate.

22. The system of claim 21, wherein the substrate includes a plurality of antenna substrates.