Optical sub-assembly for optoelectronic modules
First Claim
1. An optoelectronic package enabling optical communication with an optical fiber, the package comprising:
- a rigid base substrate having a first face and a second face that are angled relative to one another and electrical traces that extend from the first face to the second face, the base substrate being suitable for supporting photonic device on the second face of the base substrate and being suitable for aligning the photonic device with an external optical fiber when the optical fiber is mechanically engaged with the package at the second face of the block;
a semiconductor chip assembly mounted on the first face of the base substrate, the semiconductor chip assembly having a plurality of first contacts that are electrically coupled to associated traces on the base substrate; and
a photonic device mounted on the second face of the base substrate, the photonic device having at least one active facet thereon and having a plurality of second contacts that are electrically coupled to associated traces on the base substrate.
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Accused Products
Abstract
Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.
59 Citations
32 Claims
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1. An optoelectronic package enabling optical communication with an optical fiber, the package comprising:
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a rigid base substrate having a first face and a second face that are angled relative to one another and electrical traces that extend from the first face to the second face, the base substrate being suitable for supporting photonic device on the second face of the base substrate and being suitable for aligning the photonic device with an external optical fiber when the optical fiber is mechanically engaged with the package at the second face of the block;
a semiconductor chip assembly mounted on the first face of the base substrate, the semiconductor chip assembly having a plurality of first contacts that are electrically coupled to associated traces on the base substrate; and
a photonic device mounted on the second face of the base substrate, the photonic device having at least one active facet thereon and having a plurality of second contacts that are electrically coupled to associated traces on the base substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 31)
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22. An optoelectronic package comprising:
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a rigid base having a front face and a bottom face being substantially perpendicular to one another, there being a smoothly rounded corner between the front face and the bottom face;
a flexible substrate adhered to the front and bottom faces, the flexible substrate having electrical traces formed thereon;
a driver module mounted on the flexible substrate under the bottom face, the driver module having a plurality of first contacts that are electrically coupled to associated traces on the flexible substrate;
a photonic device mounted on the flexible substrate at the front face, the photonic device having at least one active facet thereon and having a plurality of second contacts that are electrically coupled to associated traces on the flexible substrate; and
an optical fiber in optical communication with the facet on the photonic device. - View Dependent Claims (23, 24, 25)
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26. An optoelectronic package comprising:
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a rigid mounting block having a first face and a second face and electrical traces that extend from the first face to the second face, the first and second faces being substantially perpendicular to one another;
a semiconductor chip assembly mounted on the first face of the rigid mounting block, the semiconductor chip assembly having a first surface having a plurality of first contacts that are electrically coupled to associated traces on the rigid mounting block by direct soldering and a second surface opposite the first surface, the second surface of the semiconductor chip assembly having plurality of second contacts that are suitable for electrical connection to external devices;
a photonic device mounted on the second face of the rigid mounting block, the photonic device having at least one active facet thereon and having a cathode and at least one anode, wherein the cathode is directly soldered to an associated cathode trace on the base substrate; and
an optical fiber in optical communication with the facet on the photonic device. - View Dependent Claims (27, 28, 29, 30, 32)
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Specification