Polishing apparatus

• US 6,916,231 B2
• Filed: 09/16/2003
• Issued: 07/12/2005
• Est. Priority Date: 09/17/2002
• Status: Expired due to Term

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Wakabayashi, Satoshi
• Primary Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US10/662,396
• Publication Number:
  US 20040072499A1
• Time in Patent Office: 665 Days
• Field of Search: 451/66, 451/67, 451/73, 451/285, 451286-289, 451/290, 134/77, 134/78, 134/79, 134/160, 134/169, 134/158, 134/6, 134/902, 134/22, 134/32, 134/33, 438690-693, 15/77, 15/882, 15/883, 151/82
• US Class Current: 451/66
• CPC Class Codes: B08B 1/32 using rotary cleaning members
• CPC Class Codes: B08B 1/36 rotating about an axis orthogonal to the surface
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67219 comprising at least one polishing chamber polishing apparatuses B24B

Abstract

A polishing apparatus for polishing a workpiece has a polishing unit and a cleaning unit. The polishing unit has a polishing table having a polishing surface thereon, and a top ring for pressing the workpiece against the polishing surface. The cleaning unit has a rotatable shaft configured to be vertically movable, a holding mechanism mounted to the rotatable shaft for detachably holding the workpiece, and a plurality of cleaning devices disposed around the rotatable shaft for cleaning the workpiece which has been polished in the polishing unit.

Claims

1. A polishing apparatus for polishing a workpiece, said polishing apparatus comprising:

a polishing unit including;

a polishing table having a polishing surface thereon; and

a top ring for pressing the workpiece against said polishing surface; and

a cleaning unit including;

a rotatable shaft configured to be vertically movable;

a plurality of holding mechanisms mounted to said rotatable shaft for detachably holding the workpiece; and

a plurality of cleaning devices disposed around said rotatable shaft for cleaning the workpiece which has been polished in said polishing unit.

2. The polishing apparatus according to claim 1, wherein said plurality of cleaning devices is disposed concentrically with said rotatable shaft.

3. The polishing apparatus according to claim 1, wherein said at least one holding mechanism comprises a vacuum chucking mechanism.

4. The polishing apparatus according to claim 1, wherein said plurality of holding mechanisms comprise a chucking member for holding a periphery of the workpiece.

5. The polishing apparatus according to claim 1, wherein the number of said plurality of holding mechanism is larger than the number of said plurality of cleaning devices.