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Gas delivery apparatus and method for atomic layer deposition

  • US 6,916,398 B2
  • Filed: 12/21/2001
  • Issued: 07/12/2005
  • Est. Priority Date: 10/26/2001
  • Status: Expired due to Term
First Claim
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1. A chamber, comprising:

  • a substrate support having a substrate receiving surface;

    a chamber lid comprising;

    an expanding channel at a central portion of the chamber lid; and

    a tapered bottom surface extending from the expanding channel to a peripheral portion of the chamber lid, wherein the tapered bottom surface is shaped and sized to substantially cover the substrate receiving surface, and wherein a plurality of flow sections are defined between the tapered bottom surface of the chamber lid and the substrate receiving surface, wherein a ratio of a maximum area of the flow sections to a minimum area of the flow sections is less than about 2.0;

    one or more gas conduits coupled to the expanding channel, wherein the one or more gas conduits are positioned at an angle from a center of the expanding channel and wherein the one or more gas conduits comprise one or more valves; and

    one or more gas sources coupled to each valve.

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