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Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto

  • US 6,916,544 B2
  • Filed: 05/17/2002
  • Issued: 07/12/2005
  • Est. Priority Date: 05/17/2002
  • Status: Active Grant
First Claim
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1. A laminate composition comprising:

  • (a) a conductive substrate layer;

    (b) optionally, an adhesive layer;

    (c) a thin, tenterable polyimide layer created at least in part by reaction of at least the following components;

    (1) a tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid of the general structure embedded image

    a tetracarboxylic acid dianhydride having the general structure embedded image

    and combinations thereof;

    (2) a dicarboxylic acid component selected from the group consisting of a dicarboxylic acid, a dicarboxylic acid monoanhydride and combinations thereof, said dicarboxylic acid component including at least one cross-linkable group; and

    (3) a diamine component having the general structure
    H2N—

    R2

    NH2

    wherein R1 and R2 are divalent organic groups which may be the same or different from each other, and which each of R1 and R2 have at least six carbon atoms;

    said dicarboxylic acid component (2) being present in an amount from about 0.1 to about 5.0 mole percent with respect to the tetracarboxylic acid component (1); and

    the ratio of the sum of the moles of the tetracarboxylic acid component (1) and the dicarboxylic acid component (2) to the moles of the diamine component (3) being from about 0.90 to about 1.10; and



    wherein said laminate exhibits a peel strength of at least 10 N/cm pursuant to Japanese Industrial Standard (JIS) C-50516-1994.

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