Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
First Claim
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1. A laminate composition comprising:
- (a) a conductive substrate layer;
(b) optionally, an adhesive layer;
(c) a thin, tenterable polyimide layer created at least in part by reaction of at least the following components;
(1) a tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid of the general structure
a tetracarboxylic acid dianhydride having the general structure
and combinations thereof;
(2) a dicarboxylic acid component selected from the group consisting of a dicarboxylic acid, a dicarboxylic acid monoanhydride and combinations thereof, said dicarboxylic acid component including at least one cross-linkable group; and
(3) a diamine component having the general structure
H2N—
R2—
NH2
wherein R1 and R2 are divalent organic groups which may be the same or different from each other, and which each of R1 and R2 have at least six carbon atoms;
said dicarboxylic acid component (2) being present in an amount from about 0.1 to about 5.0 mole percent with respect to the tetracarboxylic acid component (1); and
the ratio of the sum of the moles of the tetracarboxylic acid component (1) and the dicarboxylic acid component (2) to the moles of the diamine component (3) being from about 0.90 to about 1.10; and
wherein said laminate exhibits a peel strength of at least 10 N/cm pursuant to Japanese Industrial Standard (JIS) C-50516-1994.
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Abstract
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.
26 Citations
12 Claims
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1. A laminate composition comprising:
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(a) a conductive substrate layer;
(b) optionally, an adhesive layer;
(c) a thin, tenterable polyimide layer created at least in part by reaction of at least the following components;
(1) a tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid of the general structure
a tetracarboxylic acid dianhydride having the general structure
and combinations thereof;
(2) a dicarboxylic acid component selected from the group consisting of a dicarboxylic acid, a dicarboxylic acid monoanhydride and combinations thereof, said dicarboxylic acid component including at least one cross-linkable group; and
(3) a diamine component having the general structure
H2N—
R2—
NH2
wherein R1 and R2 are divalent organic groups which may be the same or different from each other, and which each of R1 and R2 have at least six carbon atoms;
said dicarboxylic acid component (2) being present in an amount from about 0.1 to about 5.0 mole percent with respect to the tetracarboxylic acid component (1); and
the ratio of the sum of the moles of the tetracarboxylic acid component (1) and the dicarboxylic acid component (2) to the moles of the diamine component (3) being from about 0.90 to about 1.10; and
wherein said laminate exhibits a peel strength of at least 10 N/cm pursuant to Japanese Industrial Standard (JIS) C-50516-1994. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification