Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate

• US 6,916,717 B2
• Filed: 05/03/2002
• Issued: 07/12/2005
• Est. Priority Date: 05/03/2002
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Hu, Xiao M., Li, Hao, Marshall, Daniel S., Liang, Yong, Wei, Yi, Droopad, Ravindranath
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US10/137,383
• Publication Number:
  US 20030207589A1
• Time in Patent Office: 1,166 Days
• Field of Search: 438/287, 438/591, 257/410
• US Class Current: 438/287
• CPC Class Codes: C30B 25/18 characterised by the substrate
• CPC Class Codes: H01L 21/02197 the material having a perovskite structure, e.g. BaTiO3
• CPC Class Codes: H01L 21/02271 deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition H01L21/02266 takes precedence
• CPC Class Codes: H01L 21/02318 post-treatment
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02513 Microstructure
• CPC Class Codes: H01L 21/02521 Materials
• CPC Class Codes: H01L 21/31604 Deposition from a gas or vapour H01L21/31691, H01L21/31695 take precedence
• CPC Class Codes: H01L 21/31691 with perovskite structure

Abstract

High quality monocrystalline metal oxide layers are grown on a monocrystalline substrate such as a silicon wafer. The monocrystalline metal oxide is grown on the silicon substrate at a temperature low enough to prevent deleterious and simultaneous oxidation of the silicon substrate. After a layer of 1-3 monolayers of the monocrystalline oxide is grown, the growth is stopped and the crystal quality of that layer is improved by a higher temperature anneal. Following the anneal, the thickness of the layer can be increased by restarting the low temperature growth. An amorphous silicon oxide layer can be grown at the interface between the monocrystalline metal oxide layer and the silicon substrate after the thickness of the monocrystalline oxide reaches a few monolayers.

Claims

1. A method for growing a monocrystalline oxide layer on a monocrystalline substrate comprising:

positioning a monocrystalline substrate having a surface within a reaction chamber;

removing any oxide that may be present on the surface of the substrate;

heating the substrate to a first temperature;

introducing oxygen to the reaction chamber to establish a first partial pressure of to oxygen in the reaction chamber, where the chosen combination of said first temperature and said first partial pressure is such that the substrate will not substantially react with the oxygen;

introducing at least one reactant to the reaction chamber and reacting the at least one reactant and the oxygen to form a first layer of oxide;

stopping the introduction of said at least one reactant to the reaction chamber;

reducing the partial pressure of oxygen in the reaction chamber to a second partial pressure of oxygen less than the first partial pressure of oxygen; and

heating the substrate to a second temperature greater than the first temperature, where the second temperature is high enough to improve the crystalline quality of the first layer, and the second temperature is not so high as to cause the substrate to react with the first layer.

2. The method of claim 1 further comprising:

after heating the substrate to a second temperature, lowering the temperature of the substrate to a third temperature less than the second temperature;

introducing oxygen to the reaction chamber to establish a third partial pressure of oxygen in the reaction chamber, the third partial pressure of oxygen equal to or greater than the second partial pressure of oxygen;

again introducing at least one reactant to the reaction chamber and reacting the at least one reactant and the oxygen to form a second layer of oxide overlying the first layer;

stopping again introducing said at least one reactant to the reaction chamber;

reducing the partial pressure of oxygen in the reaction chamber to a fourth partial pressure of oxygen less than or equal to the third partial pressure of oxygen; and

heating the substrate to a fourth temperature greater than the third temperature, where the fourth temperature is high enough to improve the crystalline quality of the second layer.

3. The method of claim 2 further comprising forming a template overlying the second layer.

4. The method of claim 3 further comprising forming a third monocrystalline layer overlying the second layer.

5. The method of claim 4 wherein forming a third monocrystalline layer comprises forming a monocrystalline layer of semiconductor material, compound semiconductor material, oxide material, metal or non-metal material.

6. The method of claim 2 further comprising forming a layer of gate electrode material overlying the second layer.

7. The method of claim 1 wherein the monocrystalline substrate is a monocrystalline silicon substrate.

8. The method of claim 7 further comprising:

after heating the substrate to a second temperature, heating the substrate in an oxygen ambient to form an amorphous layer of silicon oxide between the monocrystalline silicon substrate and the first layer.

9. The method of claim 7 wherein introducing at least one reactant comprises introducing constituent elements of perovskite oxides.

10. The method of claim 7 wherein introducing at least one reactant comprises introducing an alkaline earth metal and a transition metal to the reaction chamber.

11. The method of claim 10 wherein introducing at least one reactant comprises introducing strontium and titanium to the reaction chamber.

12. The method of claim 1 wherein removing any oxide comprises depositing an alkaline earth metal overlying the any oxide and reacting the alkaline earth metal with the any oxide to reduce the any oxide.

13. The method of claim 12 further comprising depositing additional alkaline earth metal onto the surface of the monocrystalline substrate after reacting the alkaline earth metal with the any oxide to reduce the any oxide.

14. The method of claim 1 further comprising monitoring the first layer of oxide using RHEED during heating the substrate to a second temperature.

15. The method of claim 11 wherein heating the substrate to a first temperature comprises heating the substrate to a temperature less than 400°

C.

16. The method of claim 15 wherein heating the substrate to a first temperature comprises heating the substrate to a temperature of about 300°

C.

17. The method of claim 15 wherein heating the substrate to a second temperature comprises heating the substrate to a temperature between 600°

C. and 750°

C.

18. The method of claim 17 where the first layer has a thickness of about 1-15 angstroms.

19. The method of claim 1 further comprising forming a second monocrystalline layer overlying the first layer.

20. The method of claim 19 wherein forming a second monocrystalline layer comprises forming a monocrystalline layer of material selected from the group consisting of semiconductor material, compound semiconductor material, oxide material, metal and non-metal material.

21. The method of claim 1 further comprising forming a layer of gate electrode material overlying the first layer.

22. A method for fabricating a semiconductor structure comprising:

positioning an oxidizable monocrystalline substrate having a surface within a reaction chamber;

removing any oxide that may be present on the surface of the substrate;

heating the substrate to a first temperature;

introducing oxygen to the reaction chamber to establish a partial pressure of oxygen in the reaction chamber;

introducing at least one reactant to the reaction chamber;

reacting the oxygen and the at least one reactant at the surface of the substrate to grow an oxide on the surface;

decreasing the partial pressure of oxygen in the reaction chamber;

terminating introducing a metal reactant; and

heating the substrate to a second temperature greater than the first temperature to improve the crystalline quality of the oxide;

wherein the first temperature is a temperature at which oxidation of the at least one reactant is kinetically favored in comparison to oxidation of the oxidizable substrate.

23. A process for fabricating a semiconductor structure comprising:

providing a monocrystalline silicon substrate; and

depositing a monocrystalline perovskite oxide film overlying the monocrystalline silicon substrate, comprising;

placing the substrate in a reactor chamber;

removing any oxide that may be present on the surface of the substrate;

heating the substrate to a temperature less than about 400°

C.;

introducing oxygen and a plurality of metal reactants to the reactor chamber to grow about 1-15 angstroms of a first layer of perovskite oxide on the substrate;

heating the substrate to a second temperature between about 600°

C. and about 750°

C. to improve the crystalline quality of the perovskite oxide.

24. The process of claim 23 further comprising forming a second layer overlying the monocrystalline perovskite oxide film.

25. The process of claim 24 wherein forming a second layer comprises epitaxially forming a monocrystalline layer of material selected from the group consisting of semiconductor material, compound semiconductor material, oxide material, metal and non-metal material.