Trilayered beam MEMS device and related methods
First Claim
1. A microscale structure, comprising:
- (a) a substrate;
(b) a structural dielectric arm supported by the substrate and having upper and lower surfaces suspended above the substrate, and having a via registering with the upper and lower surfaces;
(c) a first conductive element contacting the lower surface; and
(d) a second conductive element contacting the upper surface and electrically communicating with the first conductive element through the via.
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Accused Products
Abstract
Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.
128 Citations
6 Claims
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1. A microscale structure, comprising:
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(a) a substrate;
(b) a structural dielectric arm supported by the substrate and having upper and lower surfaces suspended above the substrate, and having a via registering with the upper and lower surfaces;
(c) a first conductive element contacting the lower surface; and
(d) a second conductive element contacting the upper surface and electrically communicating with the first conductive element through the via. - View Dependent Claims (4, 5, 6)
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2. A microscale switch having a conductive interconnect, the switch comprising:
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(a) a substrate having a first conductive interconnect and a stationary electrode;
(b) a first dielectric layer formed on the first conductive interconnect;
(c) a first stationary contact attached to the first dielectric layer and having electrical communication with the first conductive interconnect;
(d) a movable structural layer including a bottom surface suspended over the first stationary contact and a top surface opposing the bottom surface;
(e) a movable electrode attached to the bottom surface of the structural layer whereby the movable electrode is separated from the stationary electrode by a first gap;
(f) an electrode interconnect attached to the top surface of the structural layer and connected to the movable electrode for electrical communication; and
(g) a movable contact attached to the bottom surface of the structural layer whereby the movable contact is separated from the first stationary contact by a second gap and positioned to contact the first stationary contact when the structural layer moves towards the first stationary contact. - View Dependent Claims (3)
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Specification