Integrated microwave filter module with a cover bonded by strips of conductive paste

• US 6,917,262 B2
• Filed: 04/05/2002
• Issued: 07/12/2005
• Est. Priority Date: 04/17/2001
• Status: Expired due to Term

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Poire, Philippe
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US10/116,037
• Publication Number:
  US 20020149039A1
• Time in Patent Office: 1,194 Days
• Field of Search: 333/247, 333/204, 257/664, 257/710, 257/728
• US Class Current: 333/204
• CPC Class Codes: H01P 3/088 Stacked transmission lines
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence

Abstract

An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line between the microwave circuits mounted on the substrate, and a conductive cover closing the integrated microwave module. The substrate comprises a line of metallized holes along both sides of the microstrip line, and a strip of conductive paste is disposed between the lines of metallized holes and the conductive cover.

Claims

1. Integrated microwave module comprising a conductive around plane, a non-conductive substrate on said around plane, at least two microwave circuits mounted on said substrate, a transmission line mounted on said substrate between said microwave circuits, and a conductive cover closing said integrated microwave module, wherein:

said substrate comprises lines of metallized holes along said transmission line on both sides of said transmission line; and

respective strips of conductive paste are disposed between said lines of metallized holes and said conductive cover,

wherein said lines of metallized holes are parallel to each other and separated by a length spacing, said conductive ground plane and a surface of said conductive cover being parallel to each other and separated by a width spacing,

wherein said width and length represent the dimensions of a cross section of a virtual rectangular waveguide which encloses said transmission line, and which is limited by said conductive ground plane, said lines of metallized holes, said strips of conductive paste and said conductive cover,

said width and length being such that said virtual rectangular waveguide presents a cutoff frequency at a predefined frequency value, and

wherein said transmission line prevents propagation, in said substrate, of unwanted frequencies above said cutoff frequency.

2. The integrated microwave module according to claim 1, wherein said predefined frequency value is higher than a passband of said transmission line, thereby preventing propagation of unwanted frequencies in said module.

3. The integrated microwave module according to claim 1, wherein said conductive paste comprises a substance, which sticks said cover to said lines of metallized holes, and a hardening substance which maintains a constant thickness of said strips of conductive paste.

4. Integrated microwave module according to claim 1, wherein the respective distance between rims of two consecutive holes of each of said lines of metallized holes depends on said predefined value of said cutoff frequency.

5. Integrated microwave module according to claim 1, wherein the surface of said conductive cover disposed over said strips of conductive paste is flat.

6. An integrated microwave module comprising a conductive ground plane, a non-conductive substrate on said ground plane, at least two microwave circuits mounted on said substrate, a microstrip filter mounted on said substrate between said microwave circuits, and a conductive cover closing said integrated microwave module, wherein:

said substrate comprises lines of metallized holes along said microstrip filter on both sides of said microstrip filter;

respective strips of conductive paste are disposed between said lines of metallized holes and said conductive cover;

said lines of metallized holes are parallel to each other and separated by a length spacing, said conductive ground plane and a surface of said conductive cover being parallel to each other and separated by a width spacing;

said width and length represent the dimensions of a cross section of a virtual rectangular waveguide which encloses said microstrip filter, and which is limited by said conductive ground plane, said lines of metallized holes, said strips of conductive paste and said conductive cover, said width and length being chosen so that said virtual rectangular waveguide presents a cutoff frequency at a predefined frequency value; and

said microstrip filter prevents propagation, in said substrate, of unwanted frequencies above said cutoff frequency.

7. Integrated microwave module according to claim 6, wherein the surface of said conductive cover disposed over said strips of conductive paste is flat.

8. Integrated microwave module according to claim 6, wherein the respective distance between rims of two consecutive holes of each of said lines of metallized holes depends on said predefined value of said cutoff frequency.

9. The integrated microwave module according to claim 6, wherein said conductive paste comprises a substance, which sticks said cover to said lines of metallized holes, and a hardening substance which maintains a constant thickness of said strips of conductive paste.

10. The integrated microwave module according to claim 6, wherein said predefined frequency value is higher than a passband of said microstrip filter, thereby preventing propagation of unwanted frequencies in said module.