Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
First Claim
1. A test apparatus for an integrated circuit wafer, comprising:
- a motherboard substrate having a bottom surface and a top surface, and a plurality of electrical conductors extending from the bottom surface to the top surface;
a probe chip substrate comprising a probe surface and a connector surface, a plurality of probe springs on the probe surface;
a plurality of electrical contacts on the connector surface, and a plurality of probe chip electrical connections, wherein each of the probe springs is electrically connected to at least one contact through at least one probe chip electrical connection;
at least one intermediate connector located between the motherboard substrate and the probe chip substrate, the intermediate connector comprising at least one electrically conductive connection between each of the plurality of electrical contacts on the probe chip substrate and each of the electrical conductors on the bottom surface of the motherboard substrate; and
a probe chip carrier attached in relation to the motherboard substrate, the probe chip carrier comprising a compliant member where in the compliant member is attached to the connector surface of the probe chip substrate;
wherein the probe chip substrate is supported by the compliant member relative to the motherboard.
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Accused Products
Abstract
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.
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Citations
67 Claims
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1. A test apparatus for an integrated circuit wafer, comprising:
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a motherboard substrate having a bottom surface and a top surface, and a plurality of electrical conductors extending from the bottom surface to the top surface;
a probe chip substrate comprising a probe surface and a connector surface, a plurality of probe springs on the probe surface;
a plurality of electrical contacts on the connector surface, and a plurality of probe chip electrical connections, wherein each of the probe springs is electrically connected to at least one contact through at least one probe chip electrical connection;
at least one intermediate connector located between the motherboard substrate and the probe chip substrate, the intermediate connector comprising at least one electrically conductive connection between each of the plurality of electrical contacts on the probe chip substrate and each of the electrical conductors on the bottom surface of the motherboard substrate; and
a probe chip carrier attached in relation to the motherboard substrate, the probe chip carrier comprising a compliant member where in the compliant member is attached to the connector surface of the probe chip substrate;
wherein the probe chip substrate is supported by the compliant member relative to the motherboard. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67)
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Specification