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Electronic component module

  • US 6,917,526 B2
  • Filed: 04/22/2004
  • Issued: 07/12/2005
  • Est. Priority Date: 04/24/2003
  • Status: Expired due to Fees
First Claim
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1. An electronic component module comprising:

  • a pair of printed-circuit boards on which a shield layer is formed;

    a spacer positioned between and fixed to said pair of printed-circuit boards, said spacer equipped with a shielding feature which forms as partitions at least a first cavity and a second cavity between said pair of printed-circuit boards;

    at least a first electronic component positioned in said first cavity and mounted on any one of said pair of printed-circuit boards and used in a first frequency band;

    at least a second electronic component positioned in said second cavity and mounted on any one of said pair of printed-circuit boards, said second electronic component used in a second frequency band different from said first frequency band; and

    a plurality of terminals formed on a surface of one of said pair of printed-circuit boards, said surface opposite that on which said spacer is mounted, said terminals connected to said first electronic component and said second electronic component via transmission lines.

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