Electronic component module

• US 6,917,526 B2
• Filed: 04/22/2004
• Issued: 07/12/2005
• Est. Priority Date: 04/24/2003
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Shimoda, Hideaki, Ikeda, Hiroshi, Asami, Shigeru, Ajioka, Eriko, Kurata, Hitoyoshi, Yamashita, Yoshinari
• Primary Examiner(s): Vu, Phuong T.
• Application Number:
  US10/829,272
• Publication Number:
  US 20040264156A1
• Time in Patent Office: 446 Days
• Field of Search: 361/752, 361/753, 361/799, 361/800, 361/816, 361/818, 361/212, 361/220, 343/778, 343/789, 343/700.MS, 343/246, 343/247, 257/728, 174/35.R, 174/52.2
• US Class Current: 361/816
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1616 Cavity shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Abstract

An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

Claims

1. An electronic component module comprising:

a pair of printed-circuit boards on which a shield layer is formed;

a spacer positioned between and fixed to said pair of printed-circuit boards, said spacer equipped with a shielding feature which forms as partitions at least a first cavity and a second cavity between said pair of printed-circuit boards;

at least a first electronic component positioned in said first cavity and mounted on any one of said pair of printed-circuit boards and used in a first frequency band;

at least a second electronic component positioned in said second cavity and mounted on any one of said pair of printed-circuit boards, said second electronic component used in a second frequency band different from said first frequency band; and

a plurality of terminals formed on a surface of one of said pair of printed-circuit boards, said surface opposite that on which said spacer is mounted, said terminals connected to said first electronic component and said second electronic component via transmission lines.

2. The electronic component module according to claim 1, comprising at least one of antenna formed on a surface of the other of said pair of printed-circuit boards which does not mount said terminals, said surface opposite that on which said spacer is mounted, wherein said antenna transmits and receives radio waves in at least one of said first frequency band and said second frequency band, said antenna is connected to said corresponding electronic components.

3. The electronic component module according to claim 1, wherein said spacer is made of a metal or a nonmetal on which a metallic shield layer is formed.

4. The electronic component module according to claim 2, wherein said spacer is made of a metal or a nonmetal on which a metallic shield layer is formed.

5. The electronic component module according to claim 1, wherein at least one of said electronic components is mounted on said printed-circuit board via a substrate component with higher heat resistance than said printed-circuit board.

6. The electronic component module according to claim 1, wherein said first electronic component is mounted on one of said pair of printed-circuit boards while said second electronic component is mounted on the other of said pair of printed-circuit boards.