Triple balanced mixer

• US 6,917,796 B2
• Filed: 09/30/2002
• Issued: 07/12/2005
• Est. Priority Date: 10/04/2001
• Status: Active Grant

• Current Assignee: Scientific Components Corporation
• Original Assignee: Scientific Components Corporation
• Inventors: Setty, Radha, Ji, Daxiong
• Primary Examiner(s): Urban, Edward R
• Assistant Examiner(s): Nguyen, Thuan
• Application Number:
  US10/260,043
• Publication Number:
  US 20030068996A1
• Time in Patent Office: 1,016 Days
• Field of Search: 455/326, 455/323, 455/324, 455/333, 455/334, 455/338, 455/311, 455/293, 455/280, 455/130, 455/325, 327/206, 327/207, 327/210, 327/220, 327/272, 327/329
• US Class Current: 455/326
• CPC Class Codes: H03D 7/1408 with diodes

Abstract

A triple balanced mixer has a compact size and is readily assembled. The triple balanced mixer has a planar substrate that is formed from several layers of low temperature co-fired ceramic. The substrate has a top layer, a bottom layer and inner layers. Vias extend through the substrate. A local oscillator balun and RF balun are located on the inner layers. An intermediate frequency balun is mounted to the top layer. Diode rings are mounted on the top layer. The diode rings are electrically connected to the local oscillator balun, the RF balun and the intermediate frequency balun through the vias.

Claims

1. A triple balanced mixer for mixing an RF input signal with a local oscillator signal to provide at an output an intermediate frequency signal, comprising:

(a) a plurality of planar ceramic layers, the plurality of planar ceramic layers including a top layer, a bottom layer and inner layers;

(b) a plurality of vias interconnecting the ceramic layers;

(c) a plurality of circuit lines located on the ceramic layers and connected to the vias;

(d) at least one diode ring mounted to the top layer and electrically connected to the vias;

(e) at least one balun mounted on the inner layers and electrically connected to the vias;

(f) a transformer mounted to the top layer and electrically connected to the vias; and

(g) a plurality of leads mounted to the bottom layer and electrically connected to the vias.

2. The triple balanced mixer according to claim 1, wherein two diode rings are mounted to the top layer.

3. The triple balanced mixer according to claim 2, wherein a first and a second balun are mounted on the inner layers and electrically connected to the vias.

4. The triple balanced mixer according to claim 3, wherein the first and second baluns each have a first and third winding located on a first inner layer and a second and fourth winding located on a second inner layer, the windings electrically connected to the vias.

5. The triple balanced mixer according to claim 2, wherein a plurality of bond pads are located on the top surface and are electrically connected to the vias, a plurality of wire bonds electrically connect the diode rings to the bond pads.

6. The triple balanced mixer according to claim 5, wherein an epoxy covers the diode rings.

7. The triple balanced mixer according to claim 5, wherein the transformer is a third balun.

8. The triple balanced mixer according to claim 7, wherein the transformer has a plurality of wires that are welded to the bond pads.

9. A triple balanced mixer comprising:

(a) a planar substrate having a plurality of layers including a top layer, a bottom layer and inner layers;

(b) a plurality of vias extending through the layers;

(c) a first and a second balun located on two of the inner layers and electrically connected to the vias;

(d) two diode rings mounted on the top layer and electrically connected to the first and second baluns through the vias;

(e) a third balun mounted to the top layer and electrically connected to the diode rings through the vias; and

(f) a plurality of leads mounted to the bottom layer and electrically connected to the vias.

10. The triple balanced mixer according to claim 9, wherein the first and second baluns each have a first and third winding located on one of the inner layers and a second and fourth winding located on another inner layer.

11. The triple balanced mixer according to claim 9, wherein the third balun has a pair of windings wound around a toroid ferrite core.

12. The triple balanced mixer according to claim 9, wherein a plurality of bond pads are located on the top surface and are electrically connected to the vias.

13. The triple balanced mixer according to claim 12, wherein a plurality of wire bonds electrically connect the diode rings to the bond pads.

14. The triple balanced mixer according to claim 11, wherein the pair of windings are electrically connected to the bond pads.

15. The triple balanced mixer according to claim 11, wherein the diode rings and the third balun are attached to the top surface by an epoxy.

16. The triple balanced mixer according to claim 11, wherein each diode ring has four diodes.

17. The triple balanced mixer according to claim 11, wherein the substrate is formed from a low temperature co-fired ceramic.

18. A triple balanced mixer comprising:

(a) Load Pull Circuit for Oscillator a planar substrate formed from a plurality of layers of fired low temperature co-fired ceramic, the substrate including a top layer, a bottom layer and inner layers;

(b) a plurality of vias extending through the substrate;

(c) a local oscillator balun and an RF balun located on the inner layers and electrically connected to the vias, the local oscillator balun adapted to receive a local oscillator signal, the RF balun adapted to receive an RF signal;

(d) an intermediate frequency balun mounted to the top layer and electrically connected to the vias, the intermediate frequency balun adapted to provide an intermediate frequency signal; and

(e) two diode rings mounted on the top layer, the diode rings electrically connected to the local oscillator balun, the RF balun and the intermediate frequency balun through the vias, the diode rings mixing the local oscillator signal with the RF signal to provide the intermediate frequency signal.

19. The triple balanced mixer according to claim 18, wherein a plurality of leads are mounted to the bottom layer and are electrically connected to the vias.

20. The triple balanced mixer according to claim 18, wherein the local oscillator balun and the RF balun each have a first and third winding located on a first inner layer and a second and fourth winding located on a second inner layer.

21. The triple balanced mixer according to claim 18, wherein a plurality of circuit lines are located on the inner layers.

22. The triple balanced mixer according to claim 20, wherein the first and third windings are magnetically coupled and the second and fourth windings are magnetically coupled.

23. The triple balanced mixer according to claim 18, wherein the plurality of layers comprise nine layers that are located adjacent each other.