Method of eliminating uncontrolled voids in sheet adhesive layer
First Claim
1. For use in an integrated circuit package, a method of affixing one package component to another package component comprising:
- forming an adhesive material region; and
forming at least one venting slot extending within the adhesive material region from a region proximate to a central region of said adhesive material region towards a side or corner of a periphery of said adhesive material region, the at least one venting slot for controlling a size and location of voids between said adhesive material region and components joined by said adhesive layer during packaging.
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Accused Products
Abstract
A preformed adhesive layer for joining components within integrated circuit packaging includes venting slots for controlling the size and location of voids within an assembled integrated circuit package. Air randomly entrapped between the surfaces of the adhesive layer and adjoining components during assembly will generally release into the venting slots during subsequent assembly and/or mounting steps performed at elevated temperatures, rather than creating internal pressures causing separation of package components or releasing into the encapsulant. Die delamination and encapsulant void problems occurring during reflow or other assembly and mounting processes as a result of entrapped air are avoided.
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Citations
19 Claims
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1. For use in an integrated circuit package, a method of affixing one package component to another package component comprising:
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forming an adhesive material region; and
forming at least one venting slot extending within the adhesive material region from a region proximate to a central region of said adhesive material region towards a side or corner of a periphery of said adhesive material region, the at least one venting slot for controlling a size and location of voids between said adhesive material region and components joined by said adhesive layer during packaging. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming a packaging material, the method comprising:
forming one or more instances of a pattern within a sheet of adhesive material for selectively affixing one packaging component to another packaging component, the pattern including at least one venting slot within the adhesive material extending within the pattern from an area proximate to a center of the pattern towards a side or a corner of a peripheral edge of the pattern, the at least one venting slot for controlling a size and location of voids between said adhesive material and components joined by said adhesive material during packaging. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of packaging an integrated circuit die comprising:
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providing a printed circuit board substrate having a die cavity through a central portion thereof and an other packaging component; and
affixing the printed circuit board substrate to the other packaging component with an adhesive layer having an opening through a center of the adhesive layer and corresponding in size to the die cavity, and at least one venting slot within the adhesive layer extending from a region proximate to the opening towards a peripheral edge of the adhesive layer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification