Dissipating heat in an array of circuit components
First Claim
Patent Images
1. A method of dissipating heat in an array of circuit components comprising:
- (a) providing a circuit board having a front and back face with a pattern of electrically conductive strips having a relatively high coefficient of thermal conductivity disposed on each of the front and back face of the board;
(b) disposing a plurality of said components in an array on one of the front and back faces of the board and connecting each of said components to the front and/or back pattern of strips;
(c) applying a layer of tape having a relatively high coefficient of thermal conductivity to each of said front and back faces of the board; and
, (d) disposing a heat sink in contact with the tape on each of the front and back faces of the board.
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Abstract
A circuit board assembly with an array of closely spaced circuit components mounted thereon. The board has a pattern of conductive strips on both front and back faces and the strips are connected through the board by thermally conductive vias. The circuit components are mounted on one side of the board and a layer of thermally conductive, double-sided adhesive tape is laid over the conductive strips on both faces of the board. Heat sinks are then applied against the tape on both sides of the board to conduct heat from the board through the tape.
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Citations
17 Claims
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1. A method of dissipating heat in an array of circuit components comprising:
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(a) providing a circuit board having a front and back face with a pattern of electrically conductive strips having a relatively high coefficient of thermal conductivity disposed on each of the front and back face of the board;
(b) disposing a plurality of said components in an array on one of the front and back faces of the board and connecting each of said components to the front and/or back pattern of strips;
(c) applying a layer of tape having a relatively high coefficient of thermal conductivity to each of said front and back faces of the board; and
,(d) disposing a heat sink in contact with the tape on each of the front and back faces of the board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. In combination a circuit board with an array of circuit components comprising:
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(a) said circuit board having a front and back face with a pattern of electrically conductive strips having a relatively high coefficient of thermal conductivity disposed on each of the front and back faces of the board;
(b) a plurality of said components disposed in an array of one of said front and back faces of the board with each of the components electrically connected to the conductive strips on the front and/or back faces;
(c) a layer of thermally conductive tape disposed over the conductive strips on each of the front and back faces of the board; and
,(d) a heat sink disposed against said layer of tape on each of said front and back faces of the board. - View Dependent Claims (14, 15, 16, 17)
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Specification