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Etch resist using printer technology

  • US 6,921,550 B2
  • Filed: 11/18/2003
  • Issued: 07/26/2005
  • Est. Priority Date: 10/29/2001
  • Status: Expired due to Fees
First Claim
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1. A printer configured to print at least directly on a copper-clad substrate to facilitate inexpensively producing a printed circuit board, comprising:

  • an adjustable feeding mechanism for feeding at least a copper-clad substrate into the printer;

    a printing mechanism, proximate to the adjustable feeding mechanism; and

    a computing device associated with the printer which stores a library of inverse circuit images; and

    one or more of the inverse circuit images are printed by the printing mechanism on the copper-clad substrate, wherein the inverse circuit image is allowed to dry, the copper-clad substrate is immersed in a tinning solution to adhere a resist mask to an exposed, uninked copper to form a tinned circuit image, and the copper-clad substrate is etched to remove copper that forms the inverse circuit image.

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