Leadless chip carrier design and structure

• US 6,921,972 B1
• Filed: 11/15/2000
• Issued: 07/26/2005
• Est. Priority Date: 02/17/1999
• Status: Expired due to Term

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Hashemi, Hassan S.
• Primary Examiner(s): Zarneke, David A.
• Application Number:
  US09/713,834
• Time in Patent Office: 1,714 Days
• Field of Search: 257/780, 774/737, 774/738, 774/706, 774/707, 774/712
• US Class Current: 257/707
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85424 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/85444 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/8547 Zirconium (Zr) as principal constituent
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/64 Impedance arrangements
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A semiconductor device is provided in the form of a chip carrier (e.g., chip/IC scale carrier for RF applications) that includes an integrated circuit chip attached to a die attach pad. The device has an interconnect substrate having an upper surface and a lower surface, with a plurality of vias passing through the thickness of the interconnect substrate from the upper surface to the lower surface. The die attach pad is located on the upper surface of the interconnect substrate, and a heat spreader is located on the lower surface of the interconnect substrate. A first group of vias is positioned to intersect both the die attach pad and the heat spreader. A second group of vias is positioned away from the die attach pad and the heat spreader. The upper surface has a plurality of bond pads that are abutting the second group of vias and the lower surface has a plurality of lands that are also abutting the second group of vias.

Claims

1. A structure comprising:

a substrate having a top surface for receiving a chip, said chip having at least one device electrode;

a die attach bond pad attached to said top surface of said substrate;

a printed circuit board attached to a bottom surface of said substrate;

at least one signal via in said substrate;

at least one bond pad abutting said at least one signal via, said at least one bond pad providing electrical connection between said at least one device electrode of said chip and said printed circuit board;

a plurality of separate thermally conductive vias in said substrate, each of said plurality of separate thermally conductive vias being coupled to a heat spreader, said heat spreader being directly attached to said bottom surface of said substrate;

a downbond coupling said chip to said die attach bond pad.

2. The structure of claim 1 wherein said chip is a semiconductor chip.

3. The structure of claim 1 wherein said substrate comprises organic material.

4. The structure of claim 3 wherein said organic material is selected from the group consisting of polytetrafluoroethylene material and an FR4 based laminate material.

5. The structure of claim 1 wherein said substrate comprises a ceramic material.

6. The structure of claim 1 wherein said at least one signal via is coupled to said at least one bond pad without utilizing a trace.

7. The structure of claim 6 wherein said at least one signal via runs from said top surface of said substrate to said bottom surface of said substrate.

8. The structure of claim 6 wherein said bond pad is electrically connected to said device electrode by a bonding wire.

9. The structure of claim 1 wherein each of said at least one signal via provides an electrical connection between said device electrode and a land, said land being electrically connected to said printed circuit board.

10. The structure of claim 9 wherein said at least one signal via is coupled to said land.

11. The structure of claim 1 wherein each of said at least one signal via provides an electrical connection between one of said at least one bond pad and a land, wherein said land is electrically connected to said printed circuit board.

12. The structure of claim 11 wherein said each of said at least one signal via is coupled to said land.

13. The structure of claim 11 wherein said bond pad is electrically connected to said device electrode by a bonding wire.

14. The structure of claim 12 wherein said bond pad is electrically connected to said device electrode by a bonding wire.

15. The structure of claim 1 wherein said at least one signal via comprises copper.

16. The structure of claim 1 wherein said at least one signal via comprises a thermally conductive material.

17. A structure comprising:

a substrate having a top surface and a bottom surface;

a die attach bond pad attached to said top surface of said substrate;

a semiconductor chip attached to said top surface of said substrate, said semiconductor chip having a plurality of device electrodes;

a heat spreader directly attached to said bottom surface of said substrate;

a first plurality of separate thermally conductive vias in said substrate, said first plurality of separate thermally conductive vias providing a connection between said semiconductor chip and said heat spreader;

a plurality of bond pads and a second plurality of signal vias arranged such that each one of said plurality of bond pads abuts a separate one of said second plurality of signal vias;

a downbond coupling said chip to said die attach bond pad.

18. The structure of claim 17 wherein said heat spreader is attached to a printed circuit board.

19. The structure of claim 18 wherein said second plurality of signal vias is located in said substrate to provide connections between said plurality of device electrodes of said semiconductor chip and said printed circuit board.

20. The structure of claim 17 wherein said first plurality of separate thermally conductive vias provide an electrical connection between said semiconductor chip and said heat spreader.

21. The structure of claim 17 wherein said first plurality of separate thermally conductive vias provide a thermal connection between said semiconductor chip and said heat spreader.

22. The structure of claim 19 wherein said second plurality of signal vias provide electrical connections between said plurality of bond pads and said printed circuit board, wherein each of said plurality of bond pads is electrically connected to a respective one of said plurality of device electrodes.

23. The structure of claim 19 wherein said second plurality of signal vias provide electrical connections between each one of said plurality of device electrodes and a respective one of a plurality of lands, said plurality of lands being electrically connected to said printed circuit board.

24. The structure of claim 17 wherein said first plurality of separate thermally conductive vias comprise copper.

25. The structure of claim 19 wherein said second plurality of signal vias comprise copper.