Electroluminescent lamp module and processing method
First Claim
Patent Images
1. An electroluminescent lamp module comprising:
- 1) a base substrate having a top surface and a bottom surface;
2) an electroluminescent lamp on the base substrate wherein the electroluminescent lamp is printed on the base substrate and comprises a rear lamp electrode layer, a dielectric layer, a phosphor layer and a transparent top lamp electrode layer; and
3) an electroluminescent lamp circuit on the base substrate the electroluminescent lamp circuit including a circuit pattern and a plurality of electrical components;
wherein the circuit pattern is printed in a predetermined pattern on the base substrate and is designed to receive later applied electrical components and the rear lamp electrode layer and transparent top lamp electrode layer being electrically connected to the circuit pattern.
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Abstract
The present invention is an EL lamp module and a method of producing an EL lamp module. The EL lamp module of the present invention provides both an EL lamp (attachable or printed) and required electrical components for the proper function of the EL lamp in a single structure, thereby eliminating the necessity of separate electrical and mechanical connections for the final application of an EL lamp. The EL lamp module includes a printed circuit pattern and printed electrical components, and/or electrical components that may be connected through conventional printing techniques utilizing conductive and non-conductive pressure sensitive adhesives.
66 Citations
68 Claims
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1. An electroluminescent lamp module comprising:
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1) a base substrate having a top surface and a bottom surface;
2) an electroluminescent lamp on the base substrate wherein the electroluminescent lamp is printed on the base substrate and comprises a rear lamp electrode layer, a dielectric layer, a phosphor layer and a transparent top lamp electrode layer; and
3) an electroluminescent lamp circuit on the base substrate the electroluminescent lamp circuit including a circuit pattern and a plurality of electrical components;
wherein the circuit pattern is printed in a predetermined pattern on the base substrate and is designed to receive later applied electrical components and the rear lamp electrode layer and transparent top lamp electrode layer being electrically connected to the circuit pattern. - View Dependent Claims (2, 3, 4, 5, 7, 8)
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6. The electroluminescent lamp module of claim 6 wherein the integrated circuit inverter chip is adhered to an interposer and the interposer is adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern.
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9. An electroluminescent lamp module comprising:
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1) a base substrate having a top surface and a bottom surface;
2) an electroluminescent lamp on the base substrate wherein the electroluminescent lamp comprises a pre-manufactured label having a rear lamp electrode contact and a transparent top lamp electrode contact; and
3) an electroluminescent lamp circuit on the base substrate the electroluminescent lamp circuit including a circuit pattern and a plurality of electrical components;
wherein the circuit pattern is printed in a predetermined pattern on the base substrate and is designed to receive later applied electrical components, the label being adhered to the base substrate such that the rear lamp electrode contact and the transparent top lamp electrode contact are electrically connected to a complimentary rear lamp electrode lead and a transparent top lamp electrode lead of the circuit pattern.
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10. The electroluminescent lamp module of claim 10 wherein the pre-manufactured label comprises a rear lamp electrode layer, a dielectric layer, a phosphor layer and a transparent top lamp electrode layer;
- wherein the rear lamp electrode layer and transparent top lamp electrode layer are electrically connected to the circuit pattern.
- View Dependent Claims (12, 13, 14, 15, 17, 18)
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11. The electroluminescent lamp module of claim 11 wherein the dielectric layer comprises a film selected from the group consisting of polyethylene terephthalate and polypropylene.
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16. The electroluminescent lamp module of claim 16 wherein the integrated circuit inverter chip is adhered to an interposer and the interposer is adhered to and electrically connected to a plurality of spaced electrical leads in the circuit pattern utilizing conductive pressure sensitive adhesive.
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19. A method of making an electroluminescent lamp module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components having a plurality of electrical contacts, the method comprising the steps of:
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(1) providing a base substrate having a top surface and a bottom surface;
(2) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts of the electrical components and with the rear lamp electrode layer and transparent top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;
(3) printing the electroluminescent lamp on the base substrate such that the rear lamp electrode layer is adapted to register with and be in electrical connection with the rear electrode lead and the transparent top lamp electrode layer is adapted to register with and be in electrical connection with the top lamp electrode lead; and
(4) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.
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- 20. The method of claim 20 wherein the electroluminescent lamp further includes a top bus bar, the top bus bar being printed on the transparent top lamp electrode layer and extending beyond the transparent top lamp electrode layer and registering in electrical connection with the top lamp electrode lead.
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28. The method of claim 28 wherein the integrated circuit inverter chip is part of an inverter chip-interposer sub-assembly.
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29. The method of claim 29 wherein the step of electrically connecting the plurality of electrical components to the circuit pattern is performed with respect to the inverter chip-interposer sub-assembly by locating the inverter chip-interposer sub-assembly over a portion of the circuit pattern and electrically connecting the inverter chip-interposer sub-assembly to the circuit pattern by placing the inverter chip-interposer sub-assembly in contact with the circuit pattern by way of conductive pressure sensitive adhesive.
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31. A method of making an electroluminescent lamp module, the module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a transparent top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components, the plurality of electrical components each having electrical contacts, the method comprising the steps of:
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(a) providing a base substrate having a top surface and a bottom surface;
(b) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts, the rear lamp electrode layer and the transparent top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;
(c) applying at least a partially pre-constructed label to the base substrate to form said electroluminescent lamp; and
(d) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.
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- 32. The method of claim 32 wherein the rear lamp electrode layer is printed on the base substrate during the same printing step as the circuit pattern.
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40. The method of claim 40 wherein the one integrated circuit inverter chip is part of an inverter chip-interposer sub-assembly.
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41. The method of claim 41 wherein the step of electrically connecting the plurality of electrical components to the circuit pattern is performed with respect to the inverter chip-interposer sub-assembly by locating the inverter chip-interposer sub-assembly over a portion of the circuit pattern and electrically connecting the inverter chip-interposer sub-assembly to the circuit pattern by placing the inverter chip-interposer sub-assembly in contact with the circuit pattern, the portion of the circuit pattern having a printed layer of conductive pressure sensitive adhesive disposed thereon.
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42. An electroluminescent label that can be mechanically applied and electrically connected to a surface with pressure sensitive adhesive, the label comprising:
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a support substrate having a top surface and a bottom surface;
a rear lamp electrode layer on the top surface of the support substrate;
a thin film dielectric on a portion of the rear lamp electrode layer, the thin film dielectric positioned such that a portion of the rear lamp electrode remains exposed on the top surface of the support substrate;
a phosphor layer on the thin film dielectric;
a top lamp electrode layer on the phosphor layer, the top lamp electrode layer including a top lamp electrode contact;
a conductive adhesive on the exposed portion of the rear lamp electrode and the top lamp electrode contact; and
a non-conductive adhesive on a portion of the top lamp electrode layer except for the top lamp electrode contact.
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- 43. The electroluminescent label of claim 43, wherein the thin film dielectric comprises a polymeric film.
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44. The electroluminescent label of claim 44, wherein the polymeric film is polyethylene terephthalate.
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50. A method of making a thin film dielectric electroluminescent label comprising the steps of:
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providing a support substrate having a top surface and a bottom surface;
depositing a rear lamp electrode layer on the top surface of the support substrate, the rear lamp electrode layer including a rear lamp electrode contact;
laminating a thin dielectric film to the rear lamp electrode layer such that the rear lamp electrode contact remains uncovered;
depositing a phosphor layer on the thin film dielectric;
depositing a top lamp electrode layer on the phosphor layer;
depositing a top lamp electrode bus bar in a pattern on the top lamp electrode layer, the top lamp electrode bus bar including a top bus bar contact;
applying a conductive adhesive on the contacts; and
applying a non-conductive adhesive on areas other than the contacts, wherein at least one of the rear and top lamp electrodes is transparent.
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- 51. The method of claim 51, wherein the rear lamp electrode layer, the phosphor layer and the top lamp electrode layer are deposited with flexographic printing.
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54. The method of claim 54, wherein the polymeric film is polyethylene terephthalate.
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57. An electroluminescent label that can be mechanically applied and electrically connected to a surface with pressure sensitive adhesive, the label comprising:
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a support substrate having a top surface and a bottom surface;
a bottom bus bar on the support substrate;
a transparent lamp electrode layer on the bottom bus bar;
a phosphor layer on the transparent lamp electrode layer;
a thin film dielectric layer applied over the phosphor layer such that a portion of at least the bottom bus bar remains uncovered;
a rear lamp electrode layer on the thin film dielectric; and
a conductive adhesive on the exposed portion of the bottom bus bar and at least a portion of the rear lamp electrode layer.
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- 58. The electroluminescent label of claim 58, wherein the thin film dielectric is a polymeric film.
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59. The electroluminescent label of claim 59, wherein the polymeric film is polyethylene terephthalate.
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63. A method of making an electroluminescent lamp module having an electroluminescent lamp comprising a rear lamp electrode layer, a dielectric layer, a phosphor layer, and a top lamp electrode layer and an electroluminescent lamp circuit comprising a circuit pattern and a plurality of electrical components having electrical contacts, the method comprising the steps of:
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(a) providing a base substrate having a top surface and a bottom surface;
(b) printing the circuit pattern with a conductive material on one of the top or bottom surfaces, the circuit pattern including a plurality of electrical leads, the plurality of electrical leads adapted to electrically connect with the electrical contacts of the electrical components and with the rear lamp electrode layer and top lamp electrode layer, the circuit pattern including a rear lamp electrode lead and a top lamp electrode lead;
(c) printing the rear lamp electrode layer on the base substrate;
(d) applying the dielectric layer as a thin polymeric film over the rear lamp electrode layer;
(e) printing the phosphor layer on the thin polymeric film dielectric;
(f) printing the top lamp electrode layer on the phosphor layer; and
(g) electrically connecting the plurality of electrical components to the circuit pattern by adhering with conductive adhesive.
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- 64. The method of claim 64 wherein the electroluminescent lamp further includes a top bus bar, the top bus bar being printed on the top lamp electrode layer, the top lamp electrode layer comprising a transparent conductive material.
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67. An electroluminescent lamp comprising:
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a support substrate having a top surface and a bottom surface;
a printed circuit Pattern on said support substrate;
a rear lamp electrode layer on the top surface of the support substrate;
a thin film dielectric on the rear lamp electrode layer, the thin film dielectric applied such that a portion of the rear lamp electrode layer remains exposed on the top surface of the support substrate;
a phosphor layer on the thin film dielectric; and
a top lamp electrode layer on the phosphor layer, the top lamp electrode layer including a top lamp electrode contact, wherein said rear lame electrode layer, said thin film dielectric, said phosphor layer and said top lamp electrode are printed on said support substrate and said top lamp electrode layer and said rear lamp electrode layer are electrically connected to said circuit pattern.
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68. An electroluminescent lamp comprising:
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a support substrate having a top surface and a bottom surface;
a printed circuit pattern on said support substrate;
a bottom bus bar on the support substrate;
a transparent lamp electrode layer on the bottom bus bar;
a phosphor layer on the transparent lamp electrode layer;
a thin film dielectric layer laminated over the phosphor layer such that a portion of the bottom bus bar remains uncovered; and
a rear lamp electrode layer on the thin film dielectric, wherein said bottom bus bar, said transparent lamp electrode layer, said rear lamp electrode layer, said thin film dielectric, said phosphor layer and said top lamp electrode are printed on said support substrate and said top lamp electrode layer and said rear lamp electrode layer are electrically connected to said circuit pattern.
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Specification