Plastic liquid crystal display device and method for manufacturing the same

• US 6,922,227 B2
• Filed: 05/09/2003
• Issued: 07/26/2005
• Est. Priority Date: 09/11/2002
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chang, Hsien-Teng, Liu, Wen-Bing, Shiao, Po-Ling, Lai, Chih-Ming, Wu, Chien-Tsung, Shih, Hsi-Hsin, Liao, Chi-Chang, Wong, Yih-Jun
• Primary Examiner(s): Ton, Toan
• Application Number:
  US10/434,202
• Publication Number:
  US 20040046923A1
• Time in Patent Office: 809 Days
• Field of Search: 349/158, 349/113, 349/187
• US Class Current: 349/158
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605

Abstract

A plastic liquid crystal display device and a fabrication method thereof. A plastic substrate having a plurality of bumps on at least one surface thereof is integrally molded. A glass transition temperature (T_g) of the plastic substrate is greater than 150° C. A melt flow index (MFI) of the plastic substrate is greater than 2. A conformal reflective film on the plastic substrate with the bumps is formed. An insulating substrate opposite the plastic plate is provided. A transparent electrode is formed on an inner surface of the insulating substrate. A liquid crystal layer is inserted between the plastic substrate and the insulating substrate.

Claims

1. A method for manufacturing a plastic liquid crystal display device, comprising the steps of:

integrally molding a plastic substrate having a plurality of bumps on at least one surface thereof, wherein the plastic substrate has heat-resistant and non-deforming reproducible properties; and

forming a conformal reflective film on the plastic substrate with the bumps;

wherein the glass transition temperature (T_g) of the plastic substrate is greater than 150°

C. and the melt flow index (MFI) of the plastic substrate is greater than 2.

2. The method according to claim 1, wherein the plastic substrate is a PSF (polysulfone), PES (polyethersulfone), PAR (polyarylate), COP (cyclo olefin polymer), COC (cyclo olefin copolymer), PNB (polynorbornene), PEI (polyetherimide), PPS (polyphenylenesulfide), PEEK (polyetheretherketone) or epoxy substrate.

3. The method according to claim 1, wherein the plastic substrate with the bumps is integrally molded by hot pressing, injection molding or extrusion embossing.

4. The method according to claim 1, wherein the reflective film is an aluminum (Al) or silver (Ag) film.

5. The method according to claim 1, further comprising the steps of:

providing an insulating substrate opposite the plastic substrate;

forming a transparent electrode on an inner surface of the insulating substrate; and

forming a liquid crystal layer inserted between the plastic substrate and the insulating substrate.

6. A method for manufacturing a plastic liquid crystal display device, comprising the steps of:

integrally molding a plastic substrate having a plurality of bumps on at least one surface thereof, wherein the glass transition temperature (T_g) of the plastic substrate is greater than 150°

C. and the melt flow index (MFI) of the plastic substrate is greater than 2;

and forming a conformal reflective film on the plastic substrate with the bumps;

wherein the plastic substrate comprises COP (cyclo olefin polymer), COC (cyclo olefin copolymer) or PNB (polynorbornene).

7. The method according to claim 6, wherein the plastic substrate with the bumps is integrally molded by hot pressing, injection molding or extrusion embossing.

8. The method according to claim 6, wherein the reflective film is an aluminum (Al) or silver (Ag) film.

9. The method according to claim 6, further comprising the steps of:

providing an insulating substrate opposite the plastic plate;

forming a transparent electrode on an inner surface of the insulating substrate; and

forming a liquid crystal layer inserted between the plastic substrate and the insulating substrate.