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MEMS driver circuit arrangement

  • US 6,922,499 B2
  • Filed: 07/24/2001
  • Issued: 07/26/2005
  • Est. Priority Date: 07/24/2001
  • Status: Expired due to Term
First Claim
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1. A packaged micro electrical mechanical system (MEMS) device, comprising:

  • a packaging within which is mounted at least one optical MEMS device; and

    at least two distinct integrated circuit chips, a first one of said integrated circuit chips containing low-voltage digital-to-analog converters and a second one of said integrated circuit chips containing high-voltage amplifiers, said at least two distinct integrated circuit chips being mounted upon said packaging.

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