Method of forming a structure for supporting an integrated circuit chip

• US 6,924,168 B2
• Filed: 12/06/2001
• Issued: 08/02/2005
• Est. Priority Date: 08/31/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Tuttle, Mark
• Primary Examiner(s): Thompson, Craig A.
• Assistant Examiner(s): BEREZNY, NEMA O
• Application Number:
  US10/003,116
• Publication Number:
  US 20020050632A1
• Time in Patent Office: 1,335 Days
• Field of Search: 438/57, 438/64, 257/422, 257/660, 257/659, 361/739, 361/818, 361/816
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance

Abstract

A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.

Claims

1. A method of forming a structure for supporting an integrated circuit chip, which chip may be affected by external magnetic fields, said method comprising:

forming a substrate;

forming an insulating layer over said substrate;

providing a support surface for an integrated circuit chip, said substrate, insulating layer and support surface forming part of a chip carrier; and

supporting an integrated circuit chip with said chip carrier, said chip carrier having a top and bottom surface, wherein a layer of magnetic field shielding material is formed on said integrated circuit chip, and wherein a second layer of magnetic field shielding material is formed on a bottom of said chip.

2. The method of claim 1, further comprising providing a second layer of magnetic field shielding material on top of said chip carrier.

3. The method of claim 1, further comprising providing a second layer of magnetic field shielding material embedded within said substrate of said chip carrier.

4. The method of claim 1, further comprising providing a second layer of magnetic field shielding material embedded within a printed circuit board electrically coupled to said chip carrier.

5. The method of claim 1, wherein said semiconductor device is a magnetic memory device.

6. The method of claim 5, wherein said magnetic memory device is a magnetic random access memory device.

7. The method of claim 1, wherein said layer of magnetic field shielding material comprises a magnetic material selected from the group consisting of ferrites, manganites, chromites and cobaltites.

8. The method of claim 7, wherein said magnetic material comprises MFe₂O₄, wherein M is at least one atom selected from the group consisting of Mn, Fe, Co, Ni, Cu, and Mg.

9. The method of claim 7, wherein said magnetic material comprises a material which includes conductive particles.

10. The method of claim 9, wherein said conductive particles are selected from the group consisting of nickel particles, iron particles, and cobalt particles.

11. The method of claim 1, further comprising providing a second layer of magnetic field shielding material on the bottom surface of said chip carrier.

12. The method of claim 1, further comprising providing a second layer of magnetic field shielding material on the top surface of said chip carrier.

13. The method of claim 1, wherein said substrate comprises a flexible tape.

14. The method of claim 1, wherein said substrate is a polyimide tape.

15. The method of claim 1, further comprising forming conductive traces within said insulating layer.

16. The method of claim 1, further comprising forming conductive traces between said insulating layer and said support surface.

17. A method of forming a structure for supporting an integrated circuit chip, which chip may be affected by external magnetic fields, said method comprising:

forming a substrate;

forming an insulating layer over said substrate;

forming an elastomeric layer over said insulating layer, said substrate, insulating layer, and elastomeric layer forming part of a flip-chip carrier; and

electrically coupling a chip with said flip-chip carrier, said chip having a top and bottom surface, wherein said chip further comprises a layer of magnetic field shielding material formed on said top surface, and wherein a second layer of magnetic field shielding material is provided on the bottom surface of said chip.

18. The method of claim 17, further comprising a second layer of magnetic field shielding material provided between said substrate and said insulating layer.

19. The method of claim 17, further comprising a printed circuit board electrically coupled to said substrate, said printed circuit board having a top and bottom surface.

20. The method of claim 19, further comprising a second layer of magnetic field shielding material provided on said top surface of said printed circuit board.

21. The method of claim 19, further comprising a second layer of magnetic field shielding material provided on said bottom surface of said printed circuit board.

22. The method of claim 19, further comprising a second and third layer of magnetic field shielding material provided on said top and bottom surface of said printed circuit board.

23. The method of claim 19, further comprising a second layer of magnetic field shielding material embedded within said printed circuit board.

24. The method of claim 17, wherein said elastomeric layer comprises silicone.

25. The method of claim 24, wherein said elastomeric layer comprises a silicone-modified epoxy.

26. The method of claim 17, further comprising forming conductive traces within said insulating layer.

27. The method of claim 17, further comprising forming conductive traces between said insulating layer and said elastomeric layer.

28. A method of forming a structure for supporting an integrated circuit chip, which chip may be affected by external magnetic fields, said method comprising:

forming a substrate;

forming an insulating layer over said substrate;

providing a support surface for an integrated circuit chip, said substrate, insulating layer and support surface forming part of a chip carrier; and

supporting an integrated circuit chip with said chip carrier, said chip carrier having a top and bottom surface, wherein a layer of magnetic field shielding material is formed on said integrated circuit chip, and wherein a second layer of magnetic field shielding material is formed on said chip carrier.