Power market approach for device cooling

• US 6,925,364 B1
• Filed: 02/13/2003
• Issued: 08/02/2005
• Est. Priority Date: 02/13/2003
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Clearwater, Scott, Huberman, Bernardo
• Primary Examiner(s): Von Buhr, Maria N.
• Application Number:
  US10/365,778
• Time in Patent Office: 901 Days
• Field of Search: 700/286, 700/291, 700295-297, 700/299, 700/300, 700117-121, 705 7- 10, 705/37, 257712-722, 3612741-274, 361676-678, 361688-723
• US Class Current: 700/300
• CPC Class Codes: G05D 23/1923 using thermal energy, the cost of which varies in function of time
• CPC Class Codes: G06Q 30/08 Auctions
• CPC Class Codes: G06Q 40/04 Trading; Exchange, e.g. stocks, commodities, derivatives or currency exchange

Abstract

A market-based approach provides temperature control for a number of areas of a heat-generating device. Bids for a cooling resource are generated, each bid associated with a particular area of the device. A market price is determined at which the cooling resource is available to the device areas. Amounts of the cooling resource are allocated to the device areas based on the market price and the bids. Allocated amounts of the cooling resource are directed to the device areas.

Claims

1. A method for cooling a semiconductor device, comprising:

generating respective bids for a cooling resource associated with a plurality or semiconductor device areas;

determining a market price at which the cooling resource is available to the plurality of semiconductor device areas; and

directing allocated amounts of the cooling resource to the plurality of semiconductor device areas as a function of the market price and the bids.

2. The method of claim 1, wherein generating each bid for cooling resources comprises comparing an amount of the cooling resource required to maintain a target temperature to an actual amount of the cooling resource delivered to a particular semiconductor device area.

3. The method of claim 1, wherein generating bids for cooling resources comprises comparing temperatures sensed at the plurality of areas of the semiconductor device to target temperatures of the plurality of semiconductor device areas.

4. The method of claim 1, wherein generating the bids for cooling resources comprises detecting a cooling regime at one or more of the plurality of semiconductor device areas.

5. The method of claim 1, wherein directing the allocated amounts of cooling resource to the plurality of semiconductor device areas comprises adjusting a flow rate of a coolant.

6. The method or claim 1, wherein generating the bids comprises generating buy bids.

7. The method of claim 6, wherein generating each buy bid comprises generating a request for a quantity of the cooling resource directed to a particular semiconductor device area.

8. The method of claim 6, wherein generating each buy bid comprises generating a request for an increase in the amount of the cooling resource directed to a particular semiconductor device area.

9. The method of claim 1, wherein generating the bids comprises generating sell bids.

10. The method of claim 9, wherein generating each sell bid comprises generating a request for a decrease in the amount of the cooling resource directed to a particular semiconductor device area.

11. The method of claim 1, wherein determining the market price comprises:

determining a supply function for quantity versus price of the cooling resource;

determining a demand function for quantity versus price of the cooling resource; and

setting the market price of each unit of the cooling resource at a value at which the supply function is substantially equal to the demand function.

12. The method of claim 1, wherein allocating the cooling resource comprises:

directing an increased amount of the cooling resource to one or more of the plurality of semiconductor device areas associated with bids greater than the market price; and

directing a decreased amount of the cooling resource to one or more of the plurality of semiconductor device areas associated with bids less than the market price.

13. A method for temperature control of a semiconductor device, comprising:

generating bids for a thermal resource, each bid associated with an amount of the thermal resource desired at one of a plurality of semiconductor device areas;

determining a market price at which the thermal resource is available;

allocating the thermal resource to the plurality of semiconductor device areas based on the market price and bids; and

delivering allocated amounts of the thermal resource to the plurality of semiconductor device areas.

14. The method of claim 13, wherein the thermal resource comprises a heating resource.

15. The method of claim 13, wherein generating each bid comprises comparing an amount of the thermal resource required to maintain a target temperature to an actual amount of the thermal resource delivered to a particular semiconductor device area.

16. The method of claim 13, wherein determining the price comprises:

determining a supply function for quantity versus price of the thermal resource;

determining a demand function for quantity versus price of the thermal resource; and

setting the price of each unit or the thermal resource at a value at which the supply function is substantially equal to the demand function.

17. The method or claim 13, wherein allocating the thermal resource comprises:

directing an increased amount of the thermal resource to one or more semiconductor device areas associated with bids greater than the market price; and

directing a decreased amount of the thermal resource to one or more semiconductor device areas associated with bids less than the market price.

18. An apparatus for cooling a semiconductor device, comprising:

a sensing system for detecting a need for cooling resources at a plurality of semiconductor device areas;

a delivery system for delivering the cooling resources to the plurality of semiconductor device areas; and

a control system, coupled to the sensing system and the delivery system, and configured to generate bids for cooling resources, determine a market price of the cooling resources, and allocate the cooling resources to the plurality of semiconductor device locations based on the price and the bids.

19. The method of claim 18, wherein the control system comprises a plurality of market agents, each market agent associated with a particular semiconductor device area.

20. The method of claim 19, wherein each market agent is configured to generate bids for cooling resources by comparing an amount of the cooling resource required to maintain a target temperature at the particular semiconductor device area to an actual amount of the cooling resource delivered to the particular semiconductor device area.

21. The apparatus of claim 18, wherein the sensing system comprise an array of temperature sensors.

22. The apparatus of claim 18, wherein the sensing system comprises an optical sensor.

23. The apparatus of claim 18, wherein the sensing system comprises a cooling regime sensor.

24. The apparatus of claim 18, wherein the delivery system comprises a liquid spray cooling system.

25. The apparatus of claim 24, wherein the spray cooling system comprises an array of individually controllable sprayers, each sprayer configured to eject an incremental quantity of coolant in response to signals from the control system.

26. The apparatus of claim 18, wherein the delivery system comprises an array of thermal inkjet-type sprayers.

27. A device cooling system, comprising:

means for generating respective bids for a cooling resource associated with a plurality of heat-generating electronic device areas;

means for determining a market price at which the thermal resource is available to the plurality of heat-generating electronic device areas; and

means for directing allocated amounts of the cooling resource to the plurality of heat-generating electronic device areas as a function of the market price and the bids.

28. A temperature control system, comprising:

means for generating bids for a thermal resource, each bid associated with an amount of the thermal resource desired al one of a plurality of heat-generating electronic device areas;

means for determining a market price at which the thermal resource is available;

means for allocating the thermal resource to the plurality of heat-generating electronic device areas based on the market price and bids; and

means for delivering allocated amounts of the thermal resource to the plurality of heat-generating electronic device areas.

29. A computer-readable medium configured with instructions for causing one or more computers to perform a method for cooling a heat-generating electronic device, the method comprising:

generating respective bids for a cooling resource associated with a plurality of heat-generating electronic device areas;

determining a market price at which the cooling resource is available to the plurality of heat-generating electronic device areas; and

directing allocated amounts of the cooling resource to the plurality of heat-generating electronic device areas as a function of the market price and the bids.

30. A computer-readable medium configured with instructions for causing one or more commuters to perform a temperature control method, the method comprising:

generating bids for a thermal resource, each bid associated with an amount of the thermal resource desired at one of a plurality of heat-generating electronic device areas;

determining a market price at which the thermal resource is available;

allocating the thermal resource to the plurality of heat-generating electronic device areas based on the market price and bids; and

delivering allocated amounts of the thermal resource to the plurality of heat-generating electronic device areas.