Method for cleaning a plasma chamber
First Claim
1. A method for cleaning a plasma chamber, comprising:
- performing a first plasma etching in the plasma chamber to clean the inner wall of the plasma chamber with oxygen plasma;
performing a second plasma etching, after the first plasma etching, in the plasma chamber to clean the top and bottom of the electrode plates in the plasma chamber with chlorine and boron chloride plasma; and
performing a third plasma etching, after the second plasma etching, in the plasma chamber to clean the inner wall of the plasma chamber with sulfur hexafluoride and oxygen plasma.
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Abstract
A method for cleaning a plasma chamber after metal etching. First, a substrate having a metal layer thereon is placed in a plasma chamber. Next, the metal layer is etched. Finally, the substrate is removed from the plasma chamber to perform a dry cleaning which includes the following steps. First, the inner wall of the plasma chamber is cleaned by plasma etching using oxygen as a process gas. Next, the top and bottom electrode plates in the plasma chamber are cleaned by plasma etching using chlorine and boron chloride as process gases. Next, the inner wall of the plasma chamber is cleaned again by plasma etching using sulfur hexafluoride and oxygen as process gases. Finally, oxygen and helium used as purging gases are injected into the plasma chamber and exhausted from therein.
21 Citations
26 Claims
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1. A method for cleaning a plasma chamber, comprising:
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performing a first plasma etching in the plasma chamber to clean the inner wall of the plasma chamber with oxygen plasma;
performing a second plasma etching, after the first plasma etching, in the plasma chamber to clean the top and bottom of the electrode plates in the plasma chamber with chlorine and boron chloride plasma; and
performing a third plasma etching, after the second plasma etching, in the plasma chamber to clean the inner wall of the plasma chamber with sulfur hexafluoride and oxygen plasma. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for cleaning a plasma chamber after metal etching, comprising:
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placing a substrate having a metal layer thereon in a plasma chamber;
etching the metal layer;
removing the substrate from the plasma chamber; and
performing a dry cleaning in the plasma chamber, wherein the dry cleaning comprises;
performing a first plasma etching in the plasma chamber to clean the inner wall of the plasma chamber with oxygen plasma;
performing a second plasma etching, after the first plasma etching, in the plasma chamber to clean the top and bottom of the electrode plates in the plasma chamber with chlorine and boron chloride plasma; and
performing a third plasma etching, after the second plasma etching, in the plasma chamber to clean the inner wall of the plasma chamber with sulfur hexafluoride and oxygen plasma. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for cleaning a plasma chamber, comprising:
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performing a first plasma etching in the plasma chamber to clean the inner wall of the plasma chamber with a first oxygen-based plasma;
performing a second plasma etching, after the first plasma etching, in the plasma chamber to clean the top and bottom of the electrode plates in the plasma chamber with a chlorine and boron chloride-containing plasma; and
performing a third plasma etching, after the second plasma etching, in the plasma chamber to clean the inner wall of the plasma chamber with a second oxygen-based plasma other than the first oxygen-based plasma. - View Dependent Claims (25, 26)
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Specification