Imprint lithography for superconductor devices
First Claim
Patent Images
1. A method of building a superconductor device on a substrate, comprising:
- depositing an imprint layer on at least a portion of the substrate;
imprinting the imprint layer to provide at least one imprinted recess in the imprint layer and a non-imprinted portion of the imprint layer that at least partially surrounds the imprinted recess in the imprint layer;
depositing a first superconductor layer in at least a portion of the imprinted recess of the imprint layer;
forming a tunnel junction at least partially in contact with the first superconductor layer; and
depositing a second superconductor layer at least partially in contact with the tunnel junction, wherein at least a portion of the second superconductor layer extends beyond a portion of the imprinted recess of the imprint layer in which the first superconductor layer is deposited, wherein the first superconductor layer, the tunnel junction, and the second superconductor layer combine to form the superconductor device.
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Abstract
One aspect of this disclosure relates to a method of building a superconductor device on a substrate, comprising depositing an imprint layer on at least a portion of the substrate. The imprint layer is imprinted to provide an imprinted portion of the imprint layer and a non-imprinted portion of the imprint layer. A superconductor layer is deposited on at least a portion of the imprinted portion of the imprint layer.
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Citations
44 Claims
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1. A method of building a superconductor device on a substrate, comprising:
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depositing an imprint layer on at least a portion of the substrate; imprinting the imprint layer to provide at least one imprinted recess in the imprint layer and a non-imprinted portion of the imprint layer that at least partially surrounds the imprinted recess in the imprint layer; depositing a first superconductor layer in at least a portion of the imprinted recess of the imprint layer; forming a tunnel junction at least partially in contact with the first superconductor layer; and depositing a second superconductor layer at least partially in contact with the tunnel junction, wherein at least a portion of the second superconductor layer extends beyond a portion of the imprinted recess of the imprint layer in which the first superconductor layer is deposited, wherein the first superconductor layer, the tunnel junction, and the second superconductor layer combine to form the superconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method comprising:
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forming a substrate from a flexible material; depositing an imprint layer on at least a portion of the substrate; imprinting the imprint layer to provide an imprinted recess within the imprint layer and a non-imprinted portion of the imprint layer that at feast partially surrounds the imprinted recess; depositing a first superconductor layer in at least a portion of the imprinted region of the imprint layer; forming a tunnel junction at least partially in contact with the first superconductor layer; depositing a second superconductor layer at least partially in contact with the tunnel junction, wherein at least a portion of the second semiconductor layer extends above the non-imprinted portion of the imprint layer, wherein the first superconductor layer, the tunnel junction, and the second superconductor layer combine to form the superconductor device; and lifting-off at least a portion of the superconductor device from at least a portion of the non-imprinted portion of the imprint layer to create the portion of the superconductor device that is separate from the substrate. - View Dependent Claims (41, 42, 43, 44)
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Specification