Method for recovering a plasma process
First Claim
1. A method for automated monitoring and controlling of a semiconductor wafer plasma process comprising the steps of:
- performing a plasma process in a plasma processing system to treat a semiconductor process wafer according to a first plasma process recipe;
collecting plasma process parameters comprising at least an RF power and a plasma process time at pre-determined time intervals; and
, storing the plasma process parameters including pre-process plasma processing system parameters according to a selectively queryable database to create a plasma process history such that upon abortion of the plasma process the plasma process history may be selectively retrieved to determine a second plasma process recipe to complete the plasma process.
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Abstract
A method for automated monitoring and controlling of a semiconductor wafer plasma process including performing a plasma process in a plasma processing system to treat a semiconductor process wafer according to a first plasma process recipe; collecting plasma process parameters including at least an RF power and a plasma process time at pre-determined time intervals; and, storing the plasma process parameters including pre-process plasma processing system parameters according to a selectively queryable database to create a plasma process history such that upon abortion of the plasma process the plasma process history may be selectively retrieved to determine a second plasma process recipe to complete the plasma process.
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Citations
20 Claims
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1. A method for automated monitoring and controlling of a semiconductor wafer plasma process comprising the steps of:
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performing a plasma process in a plasma processing system to treat a semiconductor process wafer according to a first plasma process recipe;
collecting plasma process parameters comprising at least an RF power and a plasma process time at pre-determined time intervals; and
,storing the plasma process parameters including pre-process plasma processing system parameters according to a selectively queryable database to create a plasma process history such that upon abortion of the plasma process the plasma process history may be selectively retrieved to determine a second plasma process recipe to complete the plasma process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for recovering from an aborted plasma etch process comprising the steps of:
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beginning a semiconductor wafer plasma etch process in a plasma processing system according to a first plasma etch process recipe including plasma etch process recipe steps;
collecting plasma etch process parameters comprising at least an RF power and a plasma etch process time at pre-determined time intervals;
storing the plasma etch process parameters including pre-process plasma processing system parameters according to a selectively queryable database to create a plasma etch process history;
determining whether the plasma etch process has been aborted;
upon determining an aborted plasma etch process selectively retrieving from the selectively queryable database the plasma etch process history to determine a second plasma etch process recipe; and
,resuming the aborted plasma etch process to complete the plasma etch process according to the second plasma etch process recipe. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification