Termination for trench MIS device having implanted drain-drift region
First Claim
1. A semiconductor die comprising a trench MIS device, said die comprising a first layer of a first conductivity type and a second layer of a second conductivity type overlying said first layer, said die comprising a termination region comprising:
- a half-trench formed in said second layer adjacent an edge of said die;
a region of said first conductivity type extending from a bottom of said half-trench to said first layer, an insulating layer extending from said bottom of said half-trench, up a wall of said half-trench and over a surface of said second layer; and
a source metal layer over said insulating layer, said source metal layer extending from a location within said half-trench and over a surface of said second layer, said source metal layer being in electrical contact with a source region of said MIS device, an edge of said source metal layer in said half-trench being laterally spaced from said edge of said die.
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Accused Products
Abstract
A trench MIS device is formed in a semiconductor die that contains a P-epitaxial layer that overlies an N+ substrate and an N-epitaxial layer. In one embodiment, the device includes a drain-drift region that extends from the bottom of the trench to the N-epitaxial layer. A termination region of the die includes a half-trench at an edge of the die and an N-type region that extends from a bottom of the half-trench to the substrate. An insulating layer and an overlying metal layer extend from the surface of the epitaxial layer into the half-trench. Preferably, the elements of the termination region are formed during the same process steps that are used to form the active elements of the device.
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Citations
8 Claims
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1. A semiconductor die comprising a trench MIS device, said die comprising a first layer of a first conductivity type and a second layer of a second conductivity type overlying said first layer, said die comprising a termination region comprising:
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a half-trench formed in said second layer adjacent an edge of said die;
a region of said first conductivity type extending from a bottom of said half-trench to said first layer, an insulating layer extending from said bottom of said half-trench, up a wall of said half-trench and over a surface of said second layer; and
a source metal layer over said insulating layer, said source metal layer extending from a location within said half-trench and over a surface of said second layer, said source metal layer being in electrical contact with a source region of said MIS device, an edge of said source metal layer in said half-trench being laterally spaced from said edge of said die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification