Surface mountable light emitting or receiving device

• US 6,927,469 B2
• Filed: 06/17/2002
• Issued: 08/09/2005
• Est. Priority Date: 09/29/1995
• Status: Expired due to Term

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Schellhorn, Franz, Waitl, Günter, Arndt, Karlheinz
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US10/173,055
• Publication Number:
  US 20030155624A1
• Time in Patent Office: 1,149 Days
• Field of Search: 257428-436, 257/437, 257 79- 84, 257 98-100, 257/787, 257/666, 257/774, 257/680, 257/676
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Claims

1. A surface mountable device, comprising:

a lead frame;

a chip carrier part;

a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function;

a connection part positioned at a distance from the chip carrier part;

a trough body positioned at the chip carrier part having a reflective inner surface;

an encapsulation surrounding the semiconductor chip and at least a partial region of the chip carrier part wherein said chip carrier part projects from the encapsulation in the region of the trough body;

said semiconductor chip being secured in said trough body on said chip carrier part and electrically connected to said connection part; and

said chip carrier part being utilized for at least one of an electrical connection and a thermal connection.

2. A surface mountable device as claimed in claim 1, further comprising:

at least two external connections projecting from the encapsulation, said at least two external connections being directly connected to the connection part, said at least two external connections not being connected to the chip carrier part.

3. A surface mountable device as claimed in claim 1, further comprising:

at least two external connections protecting from the encapsulation, said at least two external connections being directly connected to the chip carrier part, said at least two external connections not being connected to the connection part.

4. A surface mountable device as claimed in claim 3, further comprising:

at least two further external connections projecting from the encapsulation, said at least two further external connections being directly connected to the connection part, said at least two further external connections not being connected to the chip carrier part.

5. A surface mountable device as claimed in claim 1, further comprising:

a reflection-enhancing material coated over at least a portion of the inner surface of the trough.

6. A surface mountable device as claimed in claim 1, wherein

said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.

7. A surface mountable device as claimed in claim 6, wherein the recess having inner surfaces which are coated at least partially with reflection-enhancing material.

8. A surface mountable device as claimed in claim 1, wherein the encapsulation is formed completely of a radiation-permeable material.

9. A surface mountable device as claimed in claim 1, further comprising:

at least one external connection projecting from the encapsulation separate from the chip carrier part,

said at least one external connection being directly connected to the chip carrier part, said at least one external connection not being connected to the connection part.