Method for array processing of surface acoustic wave devices
First Claim
1. A method for manufacturing an array of hermetically sealed surface acoustic wave (SAW) devices, the method comprising the steps of:
- forming a unitary array of a material having opposing first and second surfaces and a plurality of spaced cavities extending into the array from the first surface;
forming a recess from the first surface around selected cavities;
providing at least two conductive paths from within each selected cavity to at least one of the first and second surfaces of the array;
inserting and attaching a SAW die face down, in a flip-chip arrangement, into at least some of the selected cavities, each SAW die having conductive means electrically contacting the at least two conductive paths within the corresponding cavity;
solder sealing a metal lid in the recess over the inserted SAW die for hermetically sealing the SAW die within the cavity; and
then separating the array into individual SAW devices along separation lines between adjacent cavities.
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Accused Products
Abstract
An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Each cavity has a peripheral recess dimensioned to receive a lid for hermetically sealing the die within the cavity. Conductive paths are provided from the interior of the cavity to the surface of the array for providing an electrical contact with the SAW die. Individual SAW devices are then provided by cutting along separation lines between adjacent cavities after a plurality of die have been hermetically sealed within its cavity.
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Citations
10 Claims
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1. A method for manufacturing an array of hermetically sealed surface acoustic wave (SAW) devices, the method comprising the steps of:
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forming a unitary array of a material having opposing first and second surfaces and a plurality of spaced cavities extending into the array from the first surface;
forming a recess from the first surface around selected cavities;
providing at least two conductive paths from within each selected cavity to at least one of the first and second surfaces of the array;
inserting and attaching a SAW die face down, in a flip-chip arrangement, into at least some of the selected cavities, each SAW die having conductive means electrically contacting the at least two conductive paths within the corresponding cavity;
solder sealing a metal lid in the recess over the inserted SAW die for hermetically sealing the SAW die within the cavity; and
thenseparating the array into individual SAW devices along separation lines between adjacent cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An assembly for manufacturing individual surface acoustic wave (SAW) devices comprising:
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a unitary array of a nonconductive material having opposing first and second surfaces and a plurality of spaced cavities extending into the array from the first surface;
a SAW die carried face down, in a flip-chip arrangement, within at least some of the plurality of spaced cavities;
a recess formed around selected cavities extending from the first surface, at least two electrically conductive paths from the SAW die within each selected cavity to an at least one of the first and second surfaces of the array;
a lid solder sealed in each recess of the selected cavities over the inserted SAW die for hermetically sealing the die therein; and
wherein the array is separated along separation lines between adjacent cavities to form individual SAW devices therefrom. - View Dependent Claims (10)
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Specification