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Method for array processing of surface acoustic wave devices

  • US 6,928,718 B2
  • Filed: 05/24/2001
  • Issued: 08/16/2005
  • Est. Priority Date: 06/06/2000
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing an array of hermetically sealed surface acoustic wave (SAW) devices, the method comprising the steps of:

  • forming a unitary array of a material having opposing first and second surfaces and a plurality of spaced cavities extending into the array from the first surface;

    forming a recess from the first surface around selected cavities;

    providing at least two conductive paths from within each selected cavity to at least one of the first and second surfaces of the array;

    inserting and attaching a SAW die face down, in a flip-chip arrangement, into at least some of the selected cavities, each SAW die having conductive means electrically contacting the at least two conductive paths within the corresponding cavity;

    solder sealing a metal lid in the recess over the inserted SAW die for hermetically sealing the SAW die within the cavity; and

    then separating the array into individual SAW devices along separation lines between adjacent cavities.

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