Integrated gyroscope of semiconductor material with at least one sensitive axis in the sensor plane
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1. An integrated gyroscope, including an acceleration sensor comprising:
- a first driving assembly;
a first sensitive mass extending in a first direction and a second direction, said first sensitive mass being moved by said driving assembly in said first direction;
a first capacitive sensing electrode, facing said first sensitive mass, the first driving assembly, first sensitive mass, and first sensing electrode being components of a first part of the acceleration sensor;
a second driving assembly;
a second sensitive mass extending in the first direction and the second direction, said second sensitive mass being moved by said second driving assembly in said first direction; and
a second capacitive sensing electrode, facing said second sensitive mass, the second driving assembly, second sensitive mass, and second sensing electrode being components of a second part of the acceleration sensor, symmetrical to the first part, the first and second driving assemblies being connected by central springs;
wherein said acceleration sensor has a rotation axis parallel to said second direction, and said first and second sensitive masses are sensitive to forces acting in a third direction perpendicular to said first and second directions.
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Abstract
An integrated gyroscope, including an acceleration sensor formed by: a driving assembly; a sensitive mass extending in at least one first and second directions and being moved by the driving assembly in the first direction; and by a capacitive sensing electrode, facing the sensitive mass. The acceleration sensor has an rotation axis parallel to the second direction, and the sensitive mass is sensitive to forces acting in a third direction perpendicular to the other directions. The capacitive sensing electrode is formed by a conductive material region extending underneath the sensitive mass and spaced therefrom by an air gap.
72 Citations
27 Claims
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1. An integrated gyroscope, including an acceleration sensor comprising:
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a first driving assembly;
a first sensitive mass extending in a first direction and a second direction, said first sensitive mass being moved by said driving assembly in said first direction;
a first capacitive sensing electrode, facing said first sensitive mass, the first driving assembly, first sensitive mass, and first sensing electrode being components of a first part of the acceleration sensor;
a second driving assembly;
a second sensitive mass extending in the first direction and the second direction, said second sensitive mass being moved by said second driving assembly in said first direction; and
a second capacitive sensing electrode, facing said second sensitive mass, the second driving assembly, second sensitive mass, and second sensing electrode being components of a second part of the acceleration sensor, symmetrical to the first part, the first and second driving assemblies being connected by central springs;
wherein said acceleration sensor has a rotation axis parallel to said second direction, and said first and second sensitive masses are sensitive to forces acting in a third direction perpendicular to said first and second directions. - View Dependent Claims (2)
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3. An integrated gyroscope, including an acceleration sensor comprising:
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a sensitive mass extending in a first direction and a second direction, a driving assembly, said sensitive mass being moved by said driving assembly in said first direction, said driving assembly including a driving element connected to said sensitive mass through a mechanical linkage, which enables, at least to one part of said sensitive mass, a movement having a component in a third direction perpendicular to said first and second directions; and
a capacitive sensing electrode, facing said sensitive mass;
wherein said acceleration sensor has a rotation axis parallel to said second direction, and said sensitive mass is sensitive to forces acting in the third direction. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An integrated gyroscope, including an acceleration sensor comprising:
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a driving assembly;
a sensitive mass extending in a first direction and a second direction, said sensitive mass being moved by said driving assembly in said first direction; and
a capacitive sensing electrode, facing said sensitive mass;
wherein said acceleration sensor has a rotation axis parallel to said second direction, and said sensitive mass is sensitive to forces acting in a third direction perpendicular to said first and second directions;
the gyroscope comprising two symmetrical parts connected by central springs and each including an own driving assembly, an own sensitive mass, and an own capacitive sensing electrode.
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18. A device, comprising:
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a semiconductor substrate;
an electrode formed in a first layer of the substrate;
a driving element, mechanically coupled to the substrate and configured to oscillate along a first axis lying in a first plane parallel to the first layer; and
a sensing mass, mechanically coupled to the driving element and capacitively coupled to the first electrode, formed in a second layer of the substrate, the sensing mass being configured to oscillate with the driving element along the first axis lying in the first plane parallel to the first layer, and further configured to move along a second axis perpendicular to the first layer in response to angular movements of the substrate about a third axis perpendicular to the first axis and lying in the first plane. - View Dependent Claims (19, 20)
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21. A device, comprising:
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a semiconductor substrate;
a first, second, third, and fourth electrodes formed in a first layer of the substrate;
a first sensing mass, mechanically coupled to the substrate and capacitively coupled to the first and second electrodes, formed in a second layer of the substrate, the first sensing mass being configured to oscillate along a first axis lying in a first plane parallel to the first layer, and further configured to oscillate about a second axis lying in the first plane in response to forces acting along a third axis perpendicular to the first and second axes, the first sensing mass and first and second electrodes forming first and second sensing capacitors; and
a second sensing mass, mechanically coupled to the substrate and capacitively coupled to the third and fourth electrodes, formed in the second layer of the substrate, the second sensing mass configured to oscillate along the first axis lying in the first plane, and further configured to oscillate about a fourth axis, parallel to the second axis, in response to forces acting along the third axis;
the second sensing mass and third and fourth electrodes forming third and fourth sensing capacitors. - View Dependent Claims (22)
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23. A method, comprising:
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oscillating a driving element in a first axis lying in a first plane relative to a surface of a semiconductor material body, the driving element mechanically couple to the body;
moving the semiconductor material body about a second axis perpendicular to the first axis and lying in the same plane; and
detecting the movement of the semiconductor material body by detecting changes in a capacitive coupling between a sensing mass mechanically coupled to the driving body and an electrode formed on the surface of the semiconductor body, due to movements of the body in an axis perpendicular to the first plane.
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24. A device, comprising:
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a semiconductor material body;
a driving element coupled to the semiconductor material body and movable with respect to the semiconductor material body in a first axis;
a sensing mass mechanically couple to the driving element and movable with respect to the driving element in a second axis, perpendicular to the first axis; and
a capacitive electrode positioned between the semiconductor material body and the sensing mass and configured to detect movement of the sensing mass in the second axis. - View Dependent Claims (25, 26, 27)
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Specification