Curing light

• US 6,929,472 B2
• Filed: 02/05/2002
• Issued: 08/16/2005
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/072,462
• Publication Number:
  US 20020172913A1
• Time in Patent Office: 1,288 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10S 362/80 Light emitting diode
• CPC Class Codes: Y10S 362/804 Surgical or dental spotlight

Abstract

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A curing light comprising:

a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,

a longitudinal axis of said wand,

a wand housing that is at least a portion of the exterior surface of said wand, said wand housing having a top, a bottom, a left side and a right side,

a light emission control actuator which when actuated causes light to be emitted from the curing light, said light emission control actuator being located on said wand housing top,

an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, said elongate heat sink being located at least partially within said housing

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, said mounting platform being located in a position that is on the same side of the curing light as said bottom of said wand housing,

an LED chip module mounted on said mounting platform, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip,

an LED chip mounted in said well,

a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module,

said LED module being oriented so that light emitted by it is emitted generally from said wand housing bottom; and

wherein light emitted by said LED chic module is emitted at an angle of from about 30 degrees to about 150 degrees to said wand longitudinal axis.

2. A curing light comprising:

a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,

a wand housing that is at least a portion of the exterior surface of said wand, said wand housing having a top, a bottom, a left side and a right side,

a light emission control actuator which when actuated causes light to be emitted from the curing light, said light emission control actuator being located on said wand housing top,

an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, said elongate heat sink being located at least partially within said housing

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, said mounting platform being located in a position that is on the same side of the curing light as said bottom of said wand housing,

an LED chip module mounted on said mounting platform, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip,

an LED chip mounted in said well,

a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module,

wherein light emitted by said LED chip module is emitted at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.

3. A curing light comprising:

a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light,

a wand housing that is at least a portion of the exterior surface of said wand, said wand housing having a top, a bottom, a left side and a right side,

a light emission control actuator which when actuated causes light to be emitted from the curing light, said light emission control actuator being located on said wand housing top,

an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, said elongate heat sink being located at least partially within said housing

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, said mounting platform being located in a position that is on the same side of the curing light as said bottom of said wand housing,

an LED chip module mounted on said mounting platform, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip,

an LED chip mounted in said well,

a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module,

wherein light emitted by said LED chip module is emitted at an angle of about 90 degrees to said elongate heat sink longitudinal axis.